Microfluidic Thermal Element Design for High-Performance Computing
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Solution Overview
Problem
Conventional thermal management systems for high-performance computing devices have inefficiencies due to multiple thermal interfaces, which can hinder effective heat removal from heat-generating components.
Innovation Solution
A method involving modeling a heat generation map of a heat-generating component to design an initial channel structure, evaluating metrics like pressure drop and thermal resistance, and refining the design to create optimized thermal elements on the component's surface for improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal management systems use metallic heat sinks or interface components to connect working fluid to heat-generating components, then thermal management can be achieved, but the number of thermal interfaces increases which hinders effective heat removal
Solution Approach 1:
The patent merges the thermal management function directly into the heat-generating component by forming microfluidic channels and thermal elements within the component substrate itself. This integration eliminates separate metallic heat sinks and interface components, reducing the number of thermal interfaces while improving heat removal effectiveness through direct contact between the working fluid and heat-generating regions.
2Ease of manufacture
If uniform channel designs are used for thermal management, then manufacturing is simplified, but they cannot efficiently address non-uniform heat generation patterns across the component surface
Solution Approach 1:
The patent implements non-uniform channel designs where channel density, spacing, and dimensions are varied across different regions of the heat-generating component based on local heat generation patterns. High-density channel regions are placed in areas with high heat generation, while low-density regions are placed in areas with low heat generation, optimizing thermal management performance for each local zone.
3Reliability
If channel designs are optimized for minimal thermal resistance, then heat transfer efficiency improves, but pressure drop increases which requires higher pumping power
Solution Approach 1:
The patent optimizes channel design parameters including varying channel cross-sectional areas, lengths, and configurations across different regions. By carefully selecting and adjusting these parameters, the design achieves low thermal resistance in regions requiring high heat transfer while maintaining adequate flow characteristics to minimize pressure drop and pumping power requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal management by reducing pressure drop and thermal resistance, leading to more efficient heat transfer and removal from high-performance computing devices.
Implementation Method 1
at least one microfluidic thermal element positioned on the outer surface according to a channel design based at least partially on a heat generation map of the outer surface and in the microfluidic volume to transfer heat from the heat-generating component to a working fluid in the microfluidic volume
Implementation Method 2
transfer heat from the heat-generating component to a working fluid in the microfluidic volume
Data Source
AI summary
A system may model a thermal management demand of a heat-generating component on an outer surface of the heat-generating component as a heat generation map. A system may select an initial channel design based on the heat generation map. A system may evaluate the initial channel design, wherein evaluated metrics include at least pressure drop and thermal resistance of the channel design. A system may change at least one parameter of the initial channel design based on the evaluated metrics to create a refined channel design. A system may form at least one thermal element in or on the outer surface of the heat-generating component according to the refined channel design.