Microfluidic Component Sealing with UV-Cured Roll-to-Roll Lacquers

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Solution Overview

Problem

Existing methods for manufacturing microfluidic structures fail to efficiently and simply seal channels with a cover layer in a roll-to-roll process, leading to high production time and low throughput.

Innovation Solution

A method involving UV crosslinking to form covalent bonds between curable embossing and bonding lacquers, applied in a roll-to-roll process, to tightly seal microfluidic structures by forming a composite of partially cured structured and bonding lacquer layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If injection molding process is used to manufacture microfluidic structures, then manufacturing precision and structural integrity are improved, but production time increases and throughput decreases

Engineering Contradiction:

Improvemicrofluidic structure precisionVSAvoidproduction throughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the mechanical injection molding process with a chemical bonding process using UV-curable lacquers. Instead of mechanically injecting and cooling thermoplastic material, the invention uses chemical polymerization to form microfluidic structures and bond them to covers, enabling high-throughput production while maintaining precision through UV curing technology.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the fundamental parameters of the manufacturing process by using UV-curable lacquers with specific photoinitiators and polymerizable compounds. By controlling UV irradiation parameters (intensity, wavelength, exposure time) and lacquer composition, the process achieves both high precision in microfluidic structure formation and high throughput through rapid curing times.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If roll-to-roll embossing process is used to increase throughput, then production speed improves, but sealing efficiency with cover layer deteriorates

Engineering Contradiction:

Improveproduction throughputVSAvoidsealing quality

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent introduces UV-curable bonding lacquer as an intermediary substance between the embossed microfluidic structure and the cover layer. This bonding lacquer, applied in a thin layer, fills the embossed features and creates reliable hermetic seals when cured by UV irradiation, thereby maintaining sealing quality while enabling high-speed roll-to-roll processing.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention applies the bonding lacquer to the cover layer before assembly, preparing the sealing interface in advance. This preliminary application ensures that when the embossed structure is placed on the cover, the lacquer is already positioned to fill the embossed features, enabling immediate hermetic sealing upon UV curing without requiring additional sealing steps.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If thermoplastic bonding is used to join microfluidic structures, then ease of manufacture improves, but contamination risk and mechanical stress increase

Engineering Contradiction:

Improvebonding process simplicityVSAvoidcontamination and mechanical stress

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces thermal bonding processes with UV photopolymerization bonding. Instead of using heat and mechanical pressure to join thermoplastic materials, the invention uses UV irradiation to initiate polymerization of photoreactive lacquers, creating covalent bonds without thermal stress or mechanical contamination, thereby eliminating the harmful effects associated with traditional thermal bonding.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables high-throughput, cost-effective production of hermetically sealed microfluidic structures with mechanical stability and flexibility, avoiding contamination and mechanical stresses, while allowing for uniform fluid transport and temperature-controlled processes.

Implementation Method 1

curing in step (g) is carried out via the polymerization systems contained in the partially cured structured layer and the bonding lacquer layer, each containing polymerizable compounds having carbon-carbon double bonds

Methodology Applied

Scientific EffectUV crosslinking: Photopolymerisation

Implementation Method 2

the recesses of the partially cured structured layer of the bottom member are sealed by the bonding lacquer layer of the cover member to form cavities which form a microfluidic structure

Methodology Applied

Scientific EffectHermetic sealing:

Data Source

PatentUS12544753B2Component with microfluidic structures, method for the production and use thereof

Publication Date: 2026.02.10 JOANNEUM RES FORSCHUNGS GMBH

AI summary

A method of manufacturing a component having a microfluidic structure, comprising embossing recesses in an embossed lacquer layer, partially curing the embossed lacquer layer, sealing the recesses with a curable bonding lacquer layer, and curing the partially cured embossing lacquer layer and the bonding lacquer layer, as well as a component obtainable by the method and the use of the component.