Micro-LED Array Substrate Edge Roughening for Reliable Interconnects

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Solution Overview

Problem

Micro-LED display panels face issues with electrical misalignment and disconnection when spliced together for large-size displays, leading to poor display effects due to challenges in reliable electrical connections between the front and back surfaces.

Innovation Solution

A method involving roughening treatments on the edge regions of base substrates, followed by oxidation and electroplating processes to form metal wiring connections between signal input terminals of display units and signal output terminals of driving circuits, ensuring accurate and stable electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple small-size Micro-LED display panels are spliced together to achieve large-size display, then the display size is improved, but the electrical connection reliability between front and back surfaces deteriorates due to misalignment and disconnection

Engineering Contradiction:
Improvedisplay sizeVSAvoidelectrical connection reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent applies preliminary action by performing roughening treatment on the edge regions of the base substrate before forming the metal wiring. This creates a roughened region that enhances adhesion and prevents disconnection of the electrical connections between spliced display panels, ensuring reliable electrical connectivity before the actual wiring is formed.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies local quality by creating a roughened region specifically at the edge regions of the base substrate where electrical connections are formed. This localized roughening treatment enhances adhesion only at the critical connection points without affecting the entire substrate, thereby improving electrical connection reliability at the splice locations while maintaining overall display quality.

Inventive Principle:
Principle #3Local quality

2Reliability

If roughening treatment is performed on edge regions to enhance adhesion, then the electrical connection stability is improved, but the manufacturing process complexity increases

Engineering Contradiction:
Improveelectrical connection stabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The roughening treatment is applied locally only to the edge regions of the base substrate where electrical connections are formed, rather than treating the entire substrate. This localized approach enhances electrical connection stability at critical points while minimizing the additional manufacturing complexity and process time required.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method prevents dislocation and disconnection of electrical connections, allowing for normal signal reception by the display units and ensuring improved display effects by enhancing adhesion and contact area between plating layers.

Implementation Method 1

performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region

Methodology Applied
Scientific EffectRoughening treatment: Abrasion

Implementation Method 2

oxidizing the roughened region to form an oxide layer at the roughened region

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 3

immersing the oxide layer in a solvent containing metal ions, to deposit the metal ions at the roughened region to form a transition pattern

Methodology Applied
Scientific EffectMetal ion deposition: Deposition (physical)

Implementation Method 4

forming an electroplating layer by an electroplating process on the transition pattern serving as a electroplating seed layer

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS11482545B2Method of forming array substrate, array substrate and display device
Publication Date: 2022.10.25 BEIJING BOE DISPLAY TECH CO LTD
  • US11482545B2 patent drawing
  • US11482545B2 patent drawing
  • US11482545B2 patent drawing

AI summary

A method of forming an array substrate, the array substrate and a display device are provided. The method of forming the array substrate includes: in a case that a display unit is formed on one of two opposite surfaces of a base substrate and a driving circuit is formed on the other of the two opposite surfaces of the base substrate, performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region; and forming, at the roughened region, a metal wiring connecting a signal input terminal of the display unit and a signal output terminal of the driving circuit.