Micro-LED Display Assembly Holes for Stable Electrical Connection
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Solution Overview
Problem
The challenge in display devices is to prevent lighting defects and improve reliability by ensuring strong adhesion and efficient electrical connection of ultra-small light emitting diodes, particularly due to the narrow gaps between the light emitting devices and the substrate, which leads to electrical disconnection.
Innovation Solution
The solution involves a display device design with a substrate, a first insulating layer, assembling wirings, a second insulating layer with laterally extending holes, and connection electrodes. This configuration allows for stable electrical connection and adhesion by increasing the gap for metal film deposition and utilizing connection electrodes in multiple holes for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the gap between assembling wirings is decreased for high-resolution displays, then display resolution is improved, but the electrode wiring cannot be disposed between the assembling wirings resulting in electrical disconnection
Solution Approach 1:
The patent transitions from a two-dimensional planar wiring layout to a three-dimensional vertical structure by forming holes through the insulating layer and placing connection electrodes within these holes. This allows the connection electrode to contact the light emitting device from the side, bypassing the space constraint between assembling wirings and ensuring reliable electrical connection even when the gap between assembling wirings is minimized for high resolution displays.
2Manufacturing precision
If the gap between the outer side surface of the light emitting device and the inner side surface of the assembly hole is too narrow, then the assembly precision is improved, but the metal film deposition becomes unstable resulting in electrical disconnection
Solution Approach 1:
The patent performs preliminary action by forming the connection electrode within the hole structure before final assembly. The connection electrode is deposited on the inner wall of the hole and extends to contact the light emitting device, ensuring that the electrical connection path is established in advance with sufficient deposition area, thereby avoiding unstable metal film deposition that would occur in narrow gaps.
3Reliability
If the assembly hole is enlarged to widen the gap for stable metal film deposition, then the electrical connection reliability is improved, but the assembly precision for high resolution is compromised
Solution Approach 1:
The patent resolves this contradiction by moving the connection electrode placement to a different spatial dimension - within the vertical hole structure rather than in the lateral space between assembly hole wall and light emitting device. This allows the connection electrode to have sufficient deposition area along the hole wall while maintaining tight lateral tolerances for high-resolution assembly precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents electrical disconnection and lighting defects, enhances the bonding force of light emitting devices, and improves the assembly rate by utilizing a stronger dielectrophoretic force.
Implementation Method 1
improves the assembly rate by utilizing a stronger dielectrophoretic force
Data Source
AI summary
The display device can include a substrate, a first insulating layer on the substrate, first and second assembling wirings on the substrate, a second insulating layer disposed on the first and second assembling wirings and having a first hole and at least one or more second hole extending in a lateral direction of the first hole, a semiconductor light emitting device in the first hole, and a connection electrode in the second hole.