Micro-LED Assembly Openings for Corrosion-Resistant Bonding
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Solution Overview
Problem
Micro-LED displays face challenges in quickly and accurately transferring micro-LEDs to display panels due to corrosion of assembly wiring during self-assembly, leading to electrical short circuits and assembly defects, and require improved bonding and electric field distribution.
Innovation Solution
A display device design featuring a substrate with spaced assembly wirings, a planarization layer, and a light emitting device with a first electrode connected to the wiring, including auxiliary openings to enhance contact area and reduce electric field concentration, allowing for uniform side wiring and improved assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer micro-LEDs, then assembly efficiency is improved, but assembly wiring corrosion occurs causing electrical short circuits
Solution Approach 1:
The patent introduces a transfer electrode as an intermediary component between the assembly wiring and the micro-LED. This transfer electrode serves as a mediator that receives the micro-LED during self-assembly while being isolated from the corrosive fluid environment, thus preventing wiring corrosion while maintaining assembly efficiency
Solution Approach 2:
The patent extracts the micro-LED from the corrosive fluid environment by transferring it to a transfer electrode that is positioned above the fluid level. The micro-LED is taken out of the harmful environment during the transfer process, preventing corrosion of the assembly wiring while maintaining the self-assembly efficiency
2Ease of operation
If contact area between assembly wiring and light emitting device is increased for smooth self-assembly, then assembly smoothness is improved, but electric field concentration increases causing assembly defects
Solution Approach 1:
The patent applies local quality by creating different regions on the transfer electrode with different properties. The transfer electrode has a contact region that provides sufficient contact area for smooth self-assembly, while other regions are designed to avoid electric field concentration, thus achieving both assembly smoothness and manufacturing precision
Solution Approach 2:
The patent segments the transfer electrode into distinct functional regions: a contact region for receiving micro-LEDs and a transfer region for moving them to the display panel. This segmentation allows the contact region to be optimized for smooth assembly while the overall structure prevents electric field concentration that would cause defects
3Manufacturing precision
If first electrode size is reduced to improve electric field distribution, then electric field concentration is reduced, but bonding difficulty increases
Solution Approach 1:
The transfer electrode acts as an intermediary that compensates for the reduced size of the first electrode. By providing a larger contact area on the transfer electrode, the bonding process remains easy despite the smaller first electrode size, which improves electric field distribution and prevents assembly defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes wiring corrosion, reduces assembly defects, and stabilizes bonding by securing a wide electric field gradient, leading to improved assembly rates and reduced electric field asymmetry, thus enhancing the reliability of micro-LED displays.
Implementation Method 1
Micro-LED display is a display that uses micro-LED, a semiconductor light emitting device
Data Source
AI summary
A display device including a semiconductor light emitting device according to an embodiment may include a substrate, a first assembly wiring and a second assembly wiring arranged to be spaced apart from each other on the substrate, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having an opening overlapping the first assembly wiring and the second assembly wiring, a light emitting device including a first electrode placed inside the opening and electrically connected to the first assembly wiring, and wherein the opening includes a main opening and one or more auxiliary openings that are connected to the main opening and are smaller than the main opening.