MicroLED Backplane Curing for Faster Liquid Interface 3D Printing
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Solution Overview
Problem
Current 3D printing methods and devices face challenges in fabricating detailed 3D printed parts due to inefficient curing processes and require multiple steps, including manual resin supply and separate UV curing systems.
Innovation Solution
A 3D printing device with a backplane of individually controllable LEDs, sub-pixel isolation structures, and resin channels, which allows for controlled resin supply and curing using LEDs to form detailed 3D printed parts with reduced steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If current 3D printing methods use separate UV curing systems and manual resin supply, then the curing process can be performed, but the manufacturing time increases and process complexity increases
Solution Approach 1:
The patent merges the resin supply system and UV curing system into a single integrated device. The resin dispensing nozzle and LED curing array are positioned on the same moving platform, allowing both functions to be performed simultaneously in one location rather than requiring separate manual operations and separate curing stations.
Solution Approach 2:
The moving platform serves multiple functions: it holds both the resin dispensing mechanism and the LED curing array, and can position both functions at the same location on the substrate simultaneously. This multi-functional design eliminates the need for separate operations and reduces overall system complexity.
2Manufacturing precision
If current 3D printing methods use manual or external resin supply, then resin can be supplied to the printing stage, but the precision of resin placement decreases and time increases
Solution Approach 1:
The patent replaces manual resin supply operations with an automated microfluidic dispensing system. The resin is delivered through precisely controlled microchannels that can deposit exact volumes at specific locations, eliminating the imprecision and time variability associated with manual dispensing.
Solution Approach 2:
The resin dispensing and UV curing operations occur continuously and simultaneously as the moving platform traverses the substrate. The resin is deposited and immediately cured in a continuous workflow without interruption, eliminating the downtime between dispensing and curing operations that would otherwise be required.
3Reliability
If current 3D printing methods transfer the printed part to a separate system for UV curing, then complete curing can be achieved, but the manufacturing time increases and process complexity increases
Solution Approach 1:
The curing function is merged with the printing function in the same device. The LED curing array is positioned on the moving platform alongside the resin dispensing mechanism, allowing curing to occur at the point of deposition without requiring transfer to a separate curing system.
Solution Approach 2:
The UV curing is performed immediately after resin deposition while the resin is still in position on the substrate. This preliminary curing action prevents the need for later transfer operations and ensures complete curing is achieved during the printing process itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces the time required for 3D printing by integrating resin supply and curing into a single process, enabling more controlled and detailed curing of 3D printed parts.
Implementation Method 1
curing the liquid resin via a light emitted by a plurality of LEDs
Data Source
AI summary
Embodiments of the present disclosure generally relate to liquid interface 3D printing methods and devices. The device includes a backplane, the backplane having a backplane surface, the backplane surface including a plurality of LEDs, sub-pixel isolation (SI) structures disposed over the backplane surface and between the plurality of LEDs, the SI structures defining a plurality of wells, the plurality of wells having a transparent material disposed in the plurality of wells, a stage, the stage disposed over the plurality of wells, a resin well, the resin well disposed over the stage, and a plurality of resin channels, the plurality of resin channels coupled to the resin well, the resin channels extending through the backplane, the wells and the stage.