Micro-LED Backplane Detection Structure for Pre-Transfer Fault Screening
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Solution Overview
Problem
Current methods fail to detect defects in micro-LED display backplanes before mass transfer, leading to potential imaging issues due to undetected damaged or poorly contacted LED chips.
Innovation Solution
A detection structure comprising a detection circuit board and LED chip, with first and second detection lines and electrodes, is used to connect with contact electrode pairs on the display backplane, outputting a drive signal to identify abnormal contact electrode pairs before mass transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LED chip detection is performed after mass transfer by lighting the LED chip and detecting the emitting beam, then the location of fault points can be identified, but defects in the display backplane cannot be detected before mass transfer
Solution Approach 1:
The patent applies preliminary action by performing detection of the display backplane before mass transfer. The detection circuit board is coupled to the display backplane prior to the mass transfer process, enabling detection of contact electrode pairs and identification of defect locations in advance. This allows defects to be detected and repaired before LED chips are transferred, preventing wasted transfer operations on defective backplanes.
2Measurement precision
If detection is performed after mass transfer, then LED chip faults can be identified, but damaged display backplane leading to unlighted LED chips cannot be distinguished
Solution Approach 1:
The patent introduces an intermediary detection circuit board that couples to the display backplane's contact electrode pairs. This intermediary device enables direct electrical connection and detection of the backplane's contact electrodes without requiring LED chips to be mounted. By using this intermediary detection system, the patent can precisely identify whether faults originate from the backplane contact electrodes themselves, rather than from LED chip issues, thereby eliminating misidentification of fault causes.
3Productivity
If no pre-transfer detection is performed, then the manufacturing process can proceed without additional detection steps, but defects will cause imaging issues after transfer
Solution Approach 1:
The patent performs preliminary detection of the display backplane before mass transfer by coupling the detection circuit board to the contact electrode pairs. This preliminary action identifies defect locations in advance, allowing selective repair or rejection of defective backplanes before committing resources to mass transfer operations. This approach maintains high manufacturing efficiency by avoiding rework after transfer while ensuring display quality through pre-transfer quality control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables timely detection of defects on the display backplane, allowing for repair before mass transfer, thereby preventing imaging issues caused by damaged or poorly contacted LED chips.
Implementation Method 1
A detection structure is provided, which includes a detection circuit board and a detection light-emitting diode (LED) chip
Implementation Method 2
the detection LED chip is unlighted... the contact electrode pair on the display backplane corresponding to the detection LED chip is determined to be abnormal
Data Source
AI summary
A detection structure and a detection method are provided. The method includes the following. A display backplane, a detection circuit board, and a detection light-emitting diode (LED) chip are provided. The detection circuit board is disposed on the display backplane, to connect a first detection line on the detection circuit board with a first contact electrode and connect a second detection line on the detection circuit board with a second contact electrode. A drive signal is output via the display backplane to the first detection line and the second detection line. A contact electrode pair on the display backplane corresponding to the detection LED chip is determined to be abnormal on condition that the detection LED chip is unlighted.