Micro-LED Backplane Layout for High-Frequency Pixel Modulation
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Solution Overview
Problem
Micro-LED displays face limitations in reducing physical footprint and achieving high-frequency modulation due to peripheral arrangement of logic hardware, which restricts frequency modulation and display performance.
Innovation Solution
The display device features a backplane substrate with pixel logic hardware modules aligned behind the micro-LED array, reducing physical footprint and enabling high-frequency modulation by storing multi-bit pixel intensity values locally, allowing for reduced drive signal propagation distance and improved display resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If logic hardware is arranged peripherally around the micro-LED array, then device layout is simplified, but physical footprint increases and frequency modulation is restricted
Solution Approach 1:
The patent transitions from a planar peripheral arrangement to a three-dimensional stacked architecture. Logic hardware modules are positioned on a backplane substrate that is bonded to the backside of the display substrate, placing logic hardware in the vertical dimension behind the micro-LED array rather than around its periphery. This dimensional change reduces the two-dimensional footprint while maintaining functional connectivity.
Solution Approach 2:
The patent embeds logic hardware modules within the vertical structure of the display device. Each pixel logic hardware module is physically aligned behind its corresponding micro-LED, creating a nested configuration where control logic is integrated into the display stack rather than occupying peripheral space. This nesting reduces overall device area while maintaining functional separation.
2Speed
If logic hardware is positioned far from micro-LEDs, then manufacturing is easier, but drive signal propagation distance increases limiting frequency modulation
Solution Approach 1:
The patent implements local pairing between pixel logic hardware modules and micro-LEDs. Each logic module is physically aligned behind and electrically connected to its corresponding micro-LED, creating localized control units. This local quality ensures minimal propagation distance for each pixel's drive signals while maintaining ease of manufacturing through standardized module replication.
3Speed
If local memory elements are integrated near micro-LEDs, then frequency modulation capability improves, but device complexity increases
Solution Approach 1:
The patent divides the display device into discrete pixel logic hardware modules, each containing local memory elements and control logic for a specific micro-LED or group of micro-LEDs. This segmentation allows high-frequency modulation capability through localized memory integration while managing complexity through modular design that can be replicated across the display array.
Solution Approach 2:
The pixel logic hardware modules serve multiple functions: storing pixel intensity values in local memory, generating drive signals for corresponding micro-LEDs, and enabling high-frequency modulation. This multi-functionality within each module reduces overall device complexity by consolidating control functions rather than requiring separate dedicated components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances display resolution, reduces blur, and eliminates flicker effects by enabling high-frequency modulation, while allowing for non-linear encoding of pixel information, thereby improving the overall display quality.
Implementation Method 1
an array of micro-LEDs forming individual pixels
Data Source
AI summary
A display device includes a display substrate and a backplane substrate. The display substrate includes an array of micro-LEDs forming individual pixels. The backplane substrate includes a plurality of pixel logic hardware modules. Each pixel logic hardware module includes a local memory element configured to store a multi-bit pixel intensity value of a corresponding micro-LED for an image frame. The backplane substrate is bonded to a backside of the display substrate such that the pixel logic hardware modules are physically aligned behind the array of micro-LEDs and each pixel logic hardware module is electrically connected to a micro-LED of the corresponding pixel.


