Micro-LED Backplane Layout With Single-Side Vertical Interconnects
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Solution Overview
Problem
The existing fabrication process of micro light emitting diode display substrates is complex, hindering their widespread adoption.
Innovation Solution
A backplane design featuring a transparent substrate with electrode layers, micro-display light emitting devices, a protective layer, and a driving module, where electrical connections are established on a single side, eliminating the need for complex wiring on the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the existing fabrication process is used for micro light emitting diode display substrates, then the display substrate can be manufactured, but the fabrication process becomes too complex
Solution Approach 1:
The patent moves the driving module from the traditional planar configuration to a three-dimensional structure above the substrate. The driving module is positioned at a height above the micro-display light emitting devices, connected through vertical vias and connecting electrodes. This spatial reorganization separates the driving function from the display surface, simplifying the overall fabrication process by eliminating complex lateral wiring requirements.
Solution Approach 2:
The patent divides the display substrate into distinct functional layers: the substrate layer, the micro-display light emitting device layer, the protective layer, and the driving module layer. Each layer is independently fabricated and then integrated through standardized connection structures (via holes and connecting electrodes). This segmentation allows each component to be manufactured separately using optimized processes, reducing overall fabrication complexity.
2Ease of manufacture
If complex wiring is required on the substrate surface, then electrical connections can be established, but the manufacturing cost increases
Solution Approach 1:
The patent eliminates complex lateral wiring on the substrate surface by transitioning to a vertical connection architecture. The driving module is positioned above the display surface and connected through vertical vias that pass through the protective layer. This three-dimensional wiring approach reduces material requirements and manufacturing steps compared to traditional planar wiring, thereby reducing production costs.
3Productivity
If electrical connections are made on a single side, then the manufacturing process is simplified, but electrical coupling must be achieved without complex wiring
Solution Approach 1:
The patent introduces connecting electrodes as intermediary elements that bridge the gap between the micro-display light emitting devices and the driving module. These connecting electrodes are formed within vias that pass through the protective layer, providing a straightforward electrical pathway. This intermediary structure simplifies the electrical coupling process by replacing complex multi-layer wiring with direct vertical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process and reduces costs by enabling direct electrical coupling on a single side, improving product yield and reducing complexity.
Implementation Method 1
a plurality of micro-display light emitting devices provided on a side, facing away from the transparent substrate, of the electrode layer, electrically coupled to the signal transmission lines, and capable of emitting light towards the transparent substrate
Data Source
AI summary
The present disclosure provides a backplane, including: a transparent substrate; an electrode layer provided on a side of the transparent substrate and including a plurality of signal transmission lines; a plurality of micro-display light emitting devices provided on a side, facing away from the transparent substrate, of the electrode layer, electrically coupled to the signal transmission lines, and capable of emitting light towards the transparent substrate; a protective layer provided on a side, facing away from the transparent substrate, of the micro-display light emitting devices; and a driving module provided on a side, facing away the transparent substrate, of the protective layer and electrically coupled to the signal transmission lines. The present disclosure also provides a display substrate and a display device.