Micro-LED Display Panel Backside Fanout Wiring for Tiled Assembly
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Solution Overview
Problem
Existing micro-LED display panels face challenges with complex and costly wire printing processes on lateral side surfaces, leading to exposure and potential breakage of wires during assembly, and issues with poor contact and repairability of bonding wires.
Innovation Solution
The display panel design includes a fanout wiring layer within an insulation layer and a bonding wire layer in a patterned planarization layer, allowing external connection to a panel driver circuit on the back side, with the bonding wire layer being a thick metal layer to prevent poor contact and facilitate repair, and additional features like a light-shielding layer for improved contrast and a protective layer for heat dissipation and cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are printed on the lateral side surface to connect fanout wires and panel driver circuit, then electrical connection is achieved, but the process becomes complex and costly, and wires are exposed to external environment causing breakage risks
Solution Approach 1:
The patent moves the wire connection from the lateral side surface (2D plane) to the back side of the display panel (different spatial dimension). The fanout wiring layer is disposed in the insulation layer on the back side, and bonding wires connect to the panel driver circuit on the back side, eliminating the need for lateral surface wire printing and reducing process complexity while improving reliability.
Solution Approach 2:
The insulation layer serves multiple functions: it provides electrical insulation for the drive control circuit layer, contains the fanout wiring layer for electrical connections, and protects the bonding wires from external damage. This multi-functionality reduces the need for separate protective structures and simplifies the overall device complexity.
2Ease of manufacture
If thin bonding wire layer is used, then manufacturing cost is reduced, but contact quality with panel driver circuit deteriorates and repairability becomes difficult
Solution Approach 1:
The patent changes the thickness parameter of the bonding wire layer from thin to thick (greater than or equal to 1 micrometre). This parameter change improves contact quality with the panel driver circuit and enables repairability through rework, while still maintaining ease of manufacture through standardized thick metal layer deposition processes.
3Reliability
If wires are arranged on lateral side surface, then electrical connection is achieved, but wires are exposed and prone to scratching and extrusion damage during assembly
Solution Approach 1:
The patent relocates all wire connections from the lateral side surface to the back side of the display panel. The fanout wiring layer is embedded in the insulation layer on the back side, and bonding wires connect to the panel driver circuit on the back side, completely eliminating exposed lateral wires and their associated damage risks during assembly.
Solution Approach 2:
The fanout wiring layer is nested within the insulation layer, which itself is part of the display panel structure. This nesting protects the wiring layer from external damage during assembly while maintaining electrical connectivity, eliminating the need for separate wire protection measures.
Data Source
AI summary
A display panel includes: a drive control circuit layer; micro light-emitting elements, disposed on the drive control circuit layer and electrically connected to the drive control circuit layer; an insulation layer, disposed on a side of the drive control circuit layer facing away from the micro light-emitting elements; a fanout wiring layer, disposed in the insulation layer and penetrating through the insulation layer so as to form electrical connections with the micro light-emitting elements and the drive control circuit layer; a patterned planarization layer, disposed on a side of the insulation layer facing away from the drive control circuit layer; and a bonding wire layer, disposed in through-holes of the patterned planarization layer and electrically connected to the fanout wiring layer, and being used for externally connecting a panel driver circuit. Moreover, a tiled display screen including display panels tiled together is also provided.