Micro-LED Bank Groove Layout for Short-Circuit Prevention

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Solution Overview

Problem

The transfer accuracy of light-emitting elements in display devices affects the occurrence of defects, such as short-circuits between upper and lower electrodes, leading to reduced product yield and increased power consumption.

Innovation Solution

A display device design with receiving grooves in a bank layer for light-emitting elements, filled with an insulating film to prevent short-circuits and cracks, ensuring a minimum insulating film thickness around each element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If light-emitting elements are transferred to panel substrate without receiving grooves, then transfer process is simpler, but transfer accuracy decreases causing short-circuits and defects

Engineering Contradiction:
Improvetransfer accuracyVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The bank layer is segmented into multiple receiving grooves, each designed to hold a specific light-emitting element. This segmentation provides precise positioning for each element during transfer, improving transfer accuracy while maintaining a relatively simple overall structure through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The receiving grooves are pre-formed in the bank layer before the light-emitting elements are transferred to the panel substrate. This preliminary preparation of positioning structures ensures accurate placement during the transfer process without requiring complex real-time positioning mechanisms

Inventive Principle:
Principle #10Preliminary action

2Reliability

If insulating film thickness is not controlled around light-emitting elements, then manufacturing process is simpler, but short-circuits occur between upper and lower electrodes

Engineering Contradiction:
Improveelectrical insulation reliabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The receiving grooves create localized regions with controlled insulating film deposition. The grooves ensure that the insulating film achieves minimum required thickness in critical areas around the light-emitting elements, providing reliable electrical insulation where needed while allowing the rest of the structure to be manufactured with standard processes

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The receiving grooves act as intermediary structures that facilitate controlled insulating film deposition. By providing defined geometric features, the grooves enable the insulating film to achieve appropriate thickness and coverage, mediating between the deposition process and the final electrical insulation requirement

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If redundant light-emitting elements are not transferred, then productivity is higher, but short-circuits occur in areas corresponding to missing elements

Engineering Contradiction:
Improveelectrical insulation reliabilityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The receiving grooves are prepared in advance in the bank layer, providing predetermined positioning structures for all light-emitting elements including redundant ones. This allows the transfer process to efficiently place multiple elements simultaneously according to pre-defined positions, maintaining high productivity while ensuring proper insulating film coverage for electrical reliability

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20260033073A1Display device
Publication Date: 2026.01.29 LG DISPLAY CO LTD
  • US20260033073A1 patent drawing
  • US20260033073A1 patent drawing
  • US20260033073A1 patent drawing

AI summary

Disclosed is a display device including a micro light-emitting element. The display device includes: a substrate; a driving chip disposed on the substrate; a protective layer disposed on the substrate so as to surround the driving chip; an insulating layer disposed on the driving chip and the protective layer; a bank layer disposed on the insulating layer, wherein the bank layer has a first receiving groove and a second receiving groove defined therein and adjacent to each other; a light-emitting element disposed in the first receiving groove or the second receiving groove; and an optical insulating layer covering the first receiving groove, the second receiving groove, and the bank layer.