Multi-Layer Micro-LED Display Layout for Bezel-Free Panel Integration
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Solution Overview
Problem
Conventional micro-LED displays face lower fabrication throughput due to increased manufacturing time, complex repair processes, and the presence of an unwanted bezel around the perimeter, resulting from the assembly of LEDs and driving integrated circuits on the topside of a common panel.
Innovation Solution
A multi-layer display structure is implemented with LEDs on the topside of an upper substrate, connected via vias to LED bonding pads on the bottom side, and LED driver circuits on a lower substrate, allowing for separate testing and alignment of bonding pads for electrical connection, enabling bezel-free fabrication through conductive vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LEDs and driving integrated circuits are assembled together on the topside of a common panel, then electrical connection between LEDs and driver circuits is achieved, but fabrication throughput decreases and manufacturing time increases
Solution Approach 1:
The display device is divided into multiple layers: an upper substrate containing LEDs and a lower substrate containing driver circuits. This segmentation allows independent fabrication and testing of each layer before final assembly, improving throughput while maintaining reliable electrical connections through vertically-aligned conductive vias
Solution Approach 2:
The connection architecture transitions from a planar topside assembly to a three-dimensional multi-layer structure. Electrical connections are established through vertical vias penetrating the upper substrate, enabling simultaneous fabrication of multiple components without increasing manufacturing time
2Reliability
If LEDs and driving integrated circuits are assembled together on the topside of a common panel, then electrical connection is achieved, but repair process becomes complex
Solution Approach 1:
By separating LEDs and driver circuits onto different substrates, the patent enables independent repair of faulty components. Defective LEDs can be replaced on the upper substrate without affecting the driver circuits on the lower substrate, significantly simplifying the repair process
Solution Approach 2:
The lower substrate acts as an intermediary carrier for driver circuits, allowing them to be tested and repaired independently. The conductive via structure serves as an intermediary connection that maintains electrical continuity while enabling separate handling of each layer
3Device complexity
If LEDs and driving integrated circuits are assembled on the topside of a common panel, then device integration is achieved, but an unwanted bezel appears around the perimeter
Solution Approach 1:
The patent utilizes vertical stacking of substrates to achieve integration, freeing up the perimeter area of the display. By moving driver circuits to the lower substrate, the bezel area is eliminated and the display can extend to the edges of the upper substrate
Solution Approach 2:
The upper substrate is designed to extend beyond the lower substrate perimeter, creating a bezel-free display area. The driver circuits are copied or replicated on the lower substrate in a compact arrangement that does not constrain the display boundaries
Data Source
AI summary
A multi-layer display including an upper substrate including light emitting diodes (LEDs) fabricated on a topside of the upper substrate, and LED bonding pads fabricated on a bottomside of the upper substrate. The LED bonding pads being electrically connected to the LEDs through vias extending through the upper substrate. The display also including a lower substrate including LED driver circuits and driver bonding pads fabricated on a topside of the lower substrate. The driver bonding pads being electrically connected to the LED driver circuits, where the LED bonding pads and driver bonding pads are aligned and electrically connected to each other, thereby electrically connecting the LED driver circuits to the LEDs.