Micro-LED Display Bonding With Conductive Ball Position Control
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Solution Overview
Problem
Conventional display technologies, such as LCDs, face limitations in achieving small thickness, high contrast ratio, and wide viewing angles due to their complex structure, whereas self-emissive displays like micro-LEDs offer better performance but require complex bonding processes that can lead to insufficient electrical connections between inorganic light emitting elements and substrates.
Innovation Solution
A display module design featuring an inorganic light emitting element mounted on a substrate through an anisotropic conductive layer with a conductive ball control layer to restrict the movement of conductive balls during bonding, ensuring sufficient electrical contact and improved current supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic light emitting element is mounted on a substrate through an anisotropic conductive layer, then electrical connection is achieved, but conductive balls may move during bonding causing insufficient electrical connection
Solution Approach 1:
The conductive ball control layer is formed in advance on the substrate before mounting the inorganic light emitting element. This preliminary structure prevents conductive balls from moving during the bonding process, ensuring they remain properly positioned between the connection pads and electrodes for reliable electrical connection.
Solution Approach 2:
The conductive ball control layer acts as an intermediary structure between the substrate and the inorganic light emitting element. It mediates the bonding process by providing a controlled environment that restricts conductive ball movement while still allowing proper electrical connection to be established.
2Illumination intensity
If micro-LED technology is used to achieve small thickness and high contrast ratio, then display performance is improved, but bonding process complexity increases
Solution Approach 1:
The conductive ball control layer is prepared in advance on the substrate before the bonding process. This preliminary preparation simplifies the overall bonding process by pre-establishing the constraints needed for proper conductive ball positioning, reducing the complexity of controlling the bonding process itself.
Solution Approach 2:
The conductive ball control layer is selectively formed only in regions where connection pads are located, rather than covering the entire substrate. This localized approach reduces material usage and process complexity while still providing the necessary control over conductive ball movement at critical connection points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the display apparatus by maintaining a sufficient number of conductive balls between electrodes and connection pads, improving electrical connectivity and overall performance.
Implementation Method 1
The anisotropic conductive layer includes an adhesive layer and a plurality of conductive balls distributed inside the adhesive layer
Implementation Method 2
The conductive ball control layer is configured to restrict the plurality of conductive balls from moving in a direction perpendicular to a bonding direction while the inorganic light emitting element is being bonded to the anisotropic conductive layer
Implementation Method 3
an inorganic light emitting element bonded to the anisotropic conductive layer
Data Source
AI summary
In some embodiments, a display module for implementing an image using an inorganic light emitting device includes a substrate, a thin film transistor (TFT) layer provided on the substrate, a plurality of connection pads provided on the TFT layer, an anisotropic conductive layer provided on the TFT layer, an inorganic light emitting element bonded to the anisotropic conductive layer, and a conductive ball control layer provided in a surrounding area of the plurality of connection pads. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive balls distributed inside the adhesive layer. The inorganic light emitting element includes a plurality of electrodes corresponding to the plurality of connection pads. The conductive ball control layer is configured to restrict the plurality of conductive balls from moving in a direction perpendicular to a bonding direction while the inorganic light emitting element is being bonded to the anisotropic conductive layer.