MicroLED Array Optical Bonding and Black Matrix for Low Reflection
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Solution Overview
Problem
Existing light emitting devices, particularly those using microLED arrays, face challenges in achieving high optical clarity and protection against environmental factors such as dust and moisture, while maintaining efficient light transmission and reducing reflections.
Innovation Solution
A light emitting device structure comprising a backplane with an array of microLEDs, a transparent conductive layer, an optical bonding layer, a transparent cover plate, and a black matrix layer with openings, where the optical bonding layer reduces refractive index differences and the black matrix layer minimizes reflections, and the structure is protected by an anti-glare and anti-reflective layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent cover plate is used to protect the light emitting diodes, then protection against environmental factors is improved, but reflections and optical clarity deteriorate
Solution Approach 1:
An optical bonding layer is introduced as an intermediary between the transparent conductive layer and the transparent cover plate. This bonding layer has a refractive index that gradually transitions between the two layers, reducing the refractive index difference and minimizing reflections at the interface, thereby maintaining optical clarity while preserving the protective function of the cover plate.
Solution Approach 2:
The refractive index parameter is optimized by selecting materials for the optical bonding layer that provide a gradual transition. The black matrix layer is also positioned at strategic locations to absorb stray light and reduce reflections, changing the optical parameters of the system to improve overall clarity while maintaining protection.
2Illumination intensity
If a black matrix layer is added to reduce reflections, then optical clarity is improved, but device complexity increases
Solution Approach 1:
The black matrix layer serves multiple functions: it reduces reflections at interfaces, absorbs stray light to improve contrast, and can be integrated with the existing transparent cover plate structure. By combining these functions into a single layer, the patent avoids adding excessive complexity while achieving multiple optical improvements.
3Illumination intensity
If multiple layers are added to improve optical clarity, then reflections are reduced, but manufacturing complexity increases
Solution Approach 1:
The optical bonding layer and black matrix layer are integrated into the existing manufacturing process of the light emitting device. The bonding layer is applied between the transparent conductive layer and cover plate during assembly, and the black matrix layer is positioned within the cover plate structure, combining multiple optical functions into a unified manufacturing sequence rather than separate complex processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances optical clarity, reduces reflections, and provides protection against environmental factors, improving the performance and durability of the light emitting device.
Implementation Method 1
the optical bonding layer reduces refractive index differences and the black matrix layer minimizes reflections
Implementation Method 2
the black matrix layer minimizes reflections
Data Source
AI summary
A light emitting device includes a backplane, an array of light emitting diodes attached to a front side of the backplane, a transparent conductive layer contacting front side surfaces of the light emitting diodes, an optical bonding layer located over a front side surface of the transparent conductive layer, a transparent cover plate located over a front side surface of the optical bonding layer, and a black matrix layer including an array of openings therethrough, and located between the optical bonding layer and the transparent cover plate.