Micro-LED Electrode Bonding Structure to Prevent Contact Failure
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Solution Overview
Problem
Contact failure occurs between semiconductor light emitting devices and wiring electrodes when using an anisotropic conductive layer, especially as the area of the wiring substrate increases, leading to electrical connectivity issues.
Innovation Solution
A display apparatus structure is designed with a substrate, wiring electrode, semiconductor light emitting devices, conductive particles, and an adhesive layer that selectively fixes conductive particles to the surfaces of conductive electrodes, minimizing the flow of conductive particles during pressing to prevent contact failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an anisotropic conductive layer is used to connect semiconductor light emitting devices to wiring electrodes, then electrical connection is achieved through thermal compression, but contact failure occurs when the area of the wiring substrate is increased
Solution Approach 1:
The patent applies local quality by making the adhesive layer's properties non-uniform across its surface. Specifically, the adhesive layer has a first region with different adhesive properties than a second region, allowing selective bonding behavior in different areas during the pressing process, which prevents conductive particle displacement while maintaining electrical connection reliability
Solution Approach 2:
The patent changes the adhesive parameters of the adhesive layer by creating regions with different adhesive properties. This parameter variation allows the adhesive layer to selectively bond conductive particles in certain regions while remaining unbonded in other regions, preventing contact failure when the wiring substrate area is increased
2Reliability
If conductive particles are used in the anisotropic conductive layer for electrical connection, then thermal compression enables connection, but conductive particles are released and contact failure occurs during pressing
Solution Approach 1:
The patent applies preliminary anti-action by pre-bonding the adhesive layer to the substrate in a first region before the pressing process. This preliminary bonding action prevents conductive particles from being released during pressing, as the adhesive layer is already fixed in place and cannot displace the particles, thereby maintaining electrical connection stability
Solution Approach 2:
The patent segments the adhesive layer into multiple regions with different bonding states: a first region that is bonded to the substrate and a second region that is not bonded. This segmentation allows different portions of the adhesive layer to serve different functions - preventing particle release in the bonded region while allowing particle flow in the unbonded region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure prevents the release of conductive particles between the semiconductor light emitting devices and wiring electrodes, ensuring stable electrical connections and preventing contact failure.
Implementation Method 1
an adhesive layer disposed on the semiconductor light emitting device to fix the plurality of conductive particles to the semiconductor light emitting device
Implementation Method 2
The use of an anisotropic conductive layer has an advantage capable of electrically connecting a semiconductor light emitting device and a wiring electrode only by thermal compression
Data Source
AI summary
The present invention relates to a display apparatus and a method for manufacturing same and, particularly, to a display apparatus using a semiconductor light emitting device having a size of several μm to dozens of μm. The present invention provides a display apparatus comprising: a substrate; a wiring electrode disposed on the substrate; multiple semiconductor light emitting devices electrically connected to the wiring electrode; multiple conductive particles arranged between the wiring electrode and the semiconductor light emitting devices; and a bonding layer disposed on the semiconductor light emitting devices to allow the multiple conductive particles to be fixed to the semiconductor light emitting devices, wherein each of the multiple semiconductor light emitting devices includes multiple conductive electrodes, and the conductive particles are selectively fixed to only the surfaces of the conductive electrodes.