Micro-LED Panel Bonding with Pre-Bond Defect Detection
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Solution Overview
Problem
The high detection and maintenance costs associated with the complex bonding and unbonding process of Micro-LEDs in display panel manufacturing lead to lower production efficiency.
Innovation Solution
A manufacturing method that includes providing a drive substrate with stacked elastic and adhesive layers between electrodes, transferring light emitting units, connecting their electrodes to the drive electrodes, and forming a bonding layer to enhance connection strength, allowing for pre-bonding detection and repair of non-functional units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If light emitting units are bonded to the drive substrate before detection, then connection strength is improved, but repair cost and complexity increase due to unbonding requirements
Solution Approach 1:
The patent applies preliminary action by performing detection of light emitting units before the bonding process. The detection step is executed while light emitting units are still on the substrate, allowing identification and replacement of defective units before they are permanently bonded, thereby avoiding complex unbonding operations later while ensuring strong connections for functional units
2Productivity
If light emitting units are bonded before detection, then production flow is simplified, but detection and maintenance cost increases due to unbonding process
Solution Approach 1:
The patent reverses the conventional sequence by performing detection before bonding rather than after. This preliminary detection allows defective light emitting units to be identified and replaced on the source substrate before the bonding process, eliminating the need for costly unbonding operations later and reducing overall detection and maintenance costs while maintaining efficient production flow
3Ease of repair
If unbonding process is used for repair, then defective units can be replaced, but damage to light emitting units and drive substrate occurs
Solution Approach 1:
The patent performs detection and replacement of defective light emitting units before the bonding process occurs. By conducting repairs at this preliminary stage when units are not yet bonded to the drive substrate, there is no risk of damage to either the light emitting units or the drive substrate from unbonding operations, completely eliminating this harmful factor
4Ease of repair
If complex bonding and unbonding process is used, then defective units can be repaired, but production efficiency decreases
Solution Approach 1:
The patent performs detection and replacement of defective light emitting units before the bonding process. This preliminary action eliminates the need for subsequent unbonding operations, significantly simplifying the repair process and improving production efficiency by removing defective units from the process flow before they can cause delays or require complex retrieval operations
Data Source
AI summary
The present disclosure discloses a manufacturing method of display panel and a display panel. The method includes: providing a drive substrate, the drive substrate including a plurality of drive electrodes, manufacturing an elastic layer and an adhesive layer formed that are stacked between the two drive electrodes separated by a predetermined distance; transferring light emitting units to the adhesive layer, and controlling light emitting electrodes of the light emitting units to be connected to the drive electrodes; determining the light emitting units to emit light normally when the light emitting units are controlled to emit light through the drive substrate; forming a bonding layer by filling bonding material between the light emitting electrodes of the light emitting units and the drive substrate, and the bonding layer surrounding the light emitting electrodes and the drive electrodes for increasing connection strength of the light emitting electrodes and the drive electrodes.