MicroLED Transfer Bonding With Illumination-Based Defect Selection
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Solution Overview
Problem
The current process for manufacturing microLED display panels is complicated by the need to remove unilluminated micro elements, which can damage other circuits and result in low product yield due to the complexity of repairing connection electrodes and refilling solder.
Innovation Solution
A method involving a first and second transfer substrate, where micro elements are initially bonded and then supplementary micro elements are added based on a non-bonding pattern, allowing targeted bonding and reducing the need for subsequent repairs, using a detection and bonding apparatus with an optical lens and laser instrument to ensure precise placement and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all micro elements are bonded first and then unilluminated ones are removed, then complete bonding coverage is achieved, but the repair process becomes complex and product yield decreases
Solution Approach 1:
The patent performs detection and selective bonding before complete bonding. Specifically, after initial bonding of all micro elements, the system detects illuminated vs unilluminated elements, then performs selective removal only of unilluminated elements. This preliminary detection and selective action prevents the need for complex post-bonding repairs, thereby improving product yield and simplifying the overall process.
Solution Approach 2:
The patent extracts or removes only the defective unilluminated micro elements after detection, rather than dealing with all bonded elements. By using laser to precisely remove only the unilluminated micro elements and their corresponding connection electrodes, the system avoids complex repair processes and maintains high product yield.
2Reliability
If unilluminated micro elements are removed after bonding, then defective elements are eliminated, but damage to other circuits occurs and repair becomes necessary
Solution Approach 1:
The patent uses a temporary carrier plate as an intermediary during the bonding process. Micro elements are first bonded to the temporary carrier plate, then detected for illumination status. Unilluminated elements are removed with their connection electrodes intact on the array substrate. This intermediary approach allows selective removal without damaging surrounding circuits, maintaining product quality while avoiding harmful side effects.
Solution Approach 2:
The patent replaces mechanical removal methods with laser-based removal. The laser precisely targets and removes unilluminated micro elements without physical contact, eliminating the risk of mechanical damage to surrounding circuits. This substitution of mechanical system with optical field achieves defective element elimination while protecting other circuits from damage.
3Manufacturing precision
If selective bonding is performed based on detection pattern, then bonding precision is improved, but process steps increase
Solution Approach 1:
The patent merges detection and bonding operations into an integrated process. The detection device captures illumination patterns, and this information directly guides the bonding operation. By combining detection and bonding into a single coordinated process step rather than separate operations, the system achieves high bonding precision while avoiding excessive process complexity. The temporary carrier plate enables this merging by providing a stable platform for both detection and subsequent bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the bonding process, reduces damage to components, and improves product yield by enabling more targeted bonding and efficient assembly of microLED display panels.
Implementation Method 1
The detection device includes an optical lens and a display screen, the optical lens and the display screen are connected to each other, and the detection device is configured to acquire information about a first pattern formed by a position of each illuminated micro element
Implementation Method 2
The execution device includes laser instrument and is configured to receive the information about the first pattern provided by the detection device and to bond a micro element at a corresponding position according to the information about the first pattern
Data Source
AI summary
Provided are a manufacturing method of a display panel and a detection and bonding apparatus for a micro element. The manufacturing method of a display panel includes providing a first transfer substrate and performing a detection and bonding process. The first transfer substrate includes a first temporary carrier plate and a plurality of micro elements disposed on the first temporary carrier plate. The step of performing a detection and bonding process includes placing the first transfer substrate and an array substrate opposite to each other so that the drive electrode of the micro element is in contact with a connection electrode on the array substrate; supplying power to the array substrate to conduct the plurality of micro elements; and acquiring a first pattern formed by each illuminated micro element, and bonding a drive electrode of the each illuminated micro element with the connection electrode.