Micro-LED Display Bump Structure for Simplified Transfer Bonding
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Solution Overview
Problem
Current display technologies, such as LCDs and AMOLEDs, face challenges including slow response time, limited flexibility, and short lifespan, while micro-LED displays struggle with complex and inefficient transfer processes during the integration of semiconductor light emitting devices.
Innovation Solution
A display apparatus utilizing a cantilever-shaped bump structure with elastic properties to simplify the transfer process of micro-LEDs, allowing for room temperature bonding and reduced complexity in wiring, by using bumps made from materials like Cu, Sn, In, Al, Ag, Au, Ni, Ti, and Mo, and a flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional transfer process is used for micro-LED integration, then the display apparatus can be manufactured, but the transfer process becomes complex and yield decreases
Solution Approach 1:
The transfer process is segmented into distinct stages: forming bumps on the substrate, transferring micro-LEDs to the bumps, and electrical connection. This segmentation allows each stage to be optimized independently, simplifying the overall process while improving efficiency
Solution Approach 2:
Bumps serve as intermediary elements between the substrate and micro-LEDs, facilitating both mechanical support and electrical connection. This intermediary structure simplifies the transfer process by providing a predefined connection point that eliminates complex alignment and bonding procedures
2Adaptability or versatility
If conventional wiring structures are used, then electrical connection is established, but the wiring structure becomes complex and flexibility is reduced
Solution Approach 1:
The substrate is designed as a flexible thin film that can be bent and conform to different shapes. This flexible substrate eliminates the need for rigid wiring structures, allowing the display to achieve high flexibility while maintaining electrical connections through the flexible circuit traces
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical connection through integrated traces, and flexibility. By merging these functions into a single component, the wiring structure complexity is reduced while maintaining adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a more efficient and simplified process for transferring micro-LEDs, improving the yield and flexibility of display apparatuses, while maintaining high luminance characteristics and image quality.
Implementation Method 1
A display apparatus according to the present disclosure may include at least one horizontal semiconductor light emitting device having a first conductive electrode and a second conductive electrode, first and second wirings disposed to be spaced apart from each other on the substrate, and electrically connected to the first and second conductive electrodes, respectively, a first bump disposed between the first wiring and the first conductive electrode, and a second bump disposed between the second wiring and the second conductive electrode, wherein at least one of the first and second bumps protrudes toward the other one from an edge of either one of the first and second wirings
Data Source
AI summary
Discussed is a display apparatus, including at least one horizontal semiconductor light emitting device having a first conductive electrode and a second conductive electrode; first and second wirings spaced apart from each other on a substrate, and electrically connected to the first and second conductive electrodes, respectively; a first bump disposed between the first wiring and the first conductive electrode; and a second bump disposed between the second wiring and the second conductive electrode, wherein at least one of the first and second bumps protrudes toward the other one from an edge of either one of the first and second wirings.