MicroLED Integrated Chip Common Electrodes for Easier Transfer
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Solution Overview
Problem
The complex manufacturing process of microLED display panels results in reduced production and processing efficiency, affected production schedules, and lower qualification rates due to low chip yield, especially with small light-emitting chips requiring precise electrode placement and independent electrode control.
Innovation Solution
An integrated chip with a common electrode structure is developed, featuring a manufacturing method that forms electrodes in a matrix pattern with reduced wiring and increased electrode area, simplifying the circuit substrate design and reducing processing accuracy requirements, thereby improving transfer efficiency and production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple small light-emitting chips are used to achieve high resolution, then the display resolution is improved, but the manufacturing complexity increases due to frequent chip transfer operations
Solution Approach 1:
Multiple light-emitting chips are integrated into a single integrated chip that contains multiple light-emitting units arranged in a matrix. This merging approach reduces the number of separate chip transfer operations required while maintaining high display resolution, as the entire matrix can be transferred as one unit rather than individually transferring many small chips.
Solution Approach 2:
The integrated chip is divided into multiple light-emitting units with independent control electrodes, allowing each unit to be controlled separately. This segmentation enables high resolution display while simplifying manufacturing, as the integrated chip structure reduces transfer operations but the internal segmentation maintains display quality.
2Measurement precision
If each light-emitting chip has independent positive and negative electrodes, then the light-emitting control precision is improved, but the circuit substrate design complexity increases
Solution Approach 1:
Multiple electrodes are merged into a common electrode structure where a single electrode serves multiple light-emitting units. This merging reduces the total number of electrodes and simplifies circuit substrate design while maintaining precise control through the matrix arrangement of light-emitting units within the integrated chip.
3Measurement precision
If the size of light-emitting chip is reduced to increase pixel density, then the display resolution is improved, but the processing accuracy requirement increases
Solution Approach 1:
Multiple small light-emitting units are merged into a single integrated chip structure. This approach achieves high pixel density through the matrix arrangement of units while reducing processing accuracy requirements, as the integrated chip can be manufactured with standard precision and then transferred as a complete unit rather than requiring precise placement of many smaller chips.
4Area of stationary object
If multiple light-emitting chips are transferred frequently to assemble display panel, then the display area coverage is improved, but the production efficiency decreases
Solution Approach 1:
Multiple light-emitting units are merged into a single integrated chip that can cover larger display areas. This reduces the frequency of chip transfer operations needed to assemble the display panel, thereby improving production efficiency while maintaining adequate display area coverage through the matrix arrangement of light-emitting units within the integrated structure.
Data Source
AI summary
A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S1 and step S2. In step S1, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S2, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.