Micro-LED Chip Transfer Using Relay Substrate and Solvent Wetting
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Solution Overview
Problem
The productivity of micro-LED display device manufacturing is reduced due to the decreasing size of micro-LEDs and increasing size of display devices, as existing methods like laser lift off or pick and place are inefficient for transferring micro-LED chips.
Innovation Solution
A method and device for transferring electronic chips involve attaching them to a relay substrate, separating from a base substrate, wetting a target substrate with a solvent, transferring the chips to the target substrate, pressing in the thickness direction, and drying, allowing for efficient chip transfer without a predetermined adhesive, and utilizing grooves on the target substrate for alignment and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser lift off or pick and place method is used to transfer micro LEDs, then the transfer process can be performed, but productivity is reduced as the size of micro-LEDs decreases and the size of display device increases
Solution Approach 1:
The patent segments the transfer process into distinct stages: attaching micro-LEDs to a relay substrate, separating them from the base substrate, and transferring to the target substrate. This segmentation allows each stage to be optimized independently, improving overall productivity while managing process complexity.
Solution Approach 2:
The patent introduces a relay substrate as an intermediary carrier between the base substrate and the target substrate. This intermediary enables batch transfer of multiple micro-LEDs simultaneously, dramatically improving productivity compared to direct pick-and-place methods, while simplifying the overall transfer process through standardized intermediate handling.
2Strength
If adhesive is used to attach electronic chips to substrate, then strong adhesion is achieved, but the process becomes more complex and requires additional materials
Solution Approach 1:
The patent replaces chemical adhesion (adhesive) with physical adhesion mechanisms, specifically van der Waals forces, by using a solvent-wetting process. This substitution eliminates the need for additional adhesive materials and complex application processes while achieving sufficient adhesion strength for micro-LED transfer.
Solution Approach 2:
The patent changes the adhesion mechanism from chemical bonding to physical bonding by altering the interaction parameters between surfaces. By controlling surface energy through solvent wetting and applying pressure, the system achieves strong adhesion through van der Waals forces without requiring adhesive materials, simplifying the overall process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the efficiency and yield of transferring multiple electronic chips simultaneously, enhancing the productivity of micro-LED display device manufacturing by leveraging van der Waals forces for adhesion and allowing for the reuse of the relay substrate.
Implementation Method 1
wetting a target substrate using a solvent
Implementation Method 2
leveraging van der Waals forces for adhesion
Implementation Method 3
pressing the relay substrate in a thickness direction of the target substrate
Implementation Method 4
drying the target substrate
Data Source
AI summary
A method of transferring electronic chips includes attaching, to a relay substrate, the electronic chips arranged on a base substrate, separating the electronic chips from the base substrate, wetting a target substrate using a solvent, transferring, to the target substrate, the electronic chips that are attached to the relay substrate, pressing the relay substrate in a thickness direction of the target substrate, and drying the target substrate.