Micro-LED Display Electrode Layout for High-Density Chip Transfer
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Solution Overview
Problem
The manufacturing of display apparatuses using light emitting diodes with small luminous areas poses challenges due to low current density and increased complexity in mounting and replacing a large number of these diodes, which affects luminous efficacy and manufacturing yield.
Innovation Solution
A method involving the formation and transfer of light emitting diode chips onto substrates with specific electrode configurations, using laser separation and elastic substrates to manage chip placement and bonding, enhancing current density and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If light emitting diodes with small luminous area are used, then current density is increased and luminous efficacy is improved, but manufacturing complexity and difficulty of mounting increase
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: forming LED chips on a first substrate, transferring to a second substrate, and finally mounting on the display substrate. This segmentation allows each stage to be optimized independently, reducing overall manufacturing complexity while maintaining small LED chip sizes for high luminous efficacy
Solution Approach 2:
The patent introduces intermediate substrates (first substrate and second substrate) as mediators in the manufacturing process. These intermediate substrates facilitate the handling and transfer of small LED chips, making the manufacturing process more manageable and less complex while preserving the benefits of small chip size
2Loss of energy
If light emitting diodes with small luminous area are used, then current density is increased, but the number of diodes to be mounted increases
Solution Approach 1:
The patent merges multiple small LED chips onto a single intermediate substrate before final mounting. This combining approach reduces the number of separate mounting operations required, thereby improving productivity while still utilizing small LED chips that provide high luminous efficacy
Solution Approach 2:
The patent performs preliminary actions by pre-assembling LED chips on intermediate substrates before final mounting on the display substrate. This preliminary assembly reduces the complexity and time of the final mounting process, improving overall productivity while maintaining the advantages of small LED chip size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield and efficiency of mounting and repairing light emitting diodes with small luminous areas, increasing current density and simplifying the manufacturing process while maintaining luminous efficacy.
Implementation Method 1
irradiating the first manufacturing substrate with a laser to separate the plurality of light emitting diode chips from the first manufacturing substrate
Implementation Method 2
The second manufacturing substrate may have elasticity, and the transferring step may further include elongating the second manufacturing substrate along a first direction
Data Source
AI summary
A display apparatus including a substrate and having a first substrate electrode and a second substrate electrode, and light emitting sources disposed on the substrate and spaced apart from one another, the light emitting source including a light emitting structure having an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, a p-type electrode electrically connected to the p-type semiconductor layer, an n-type electrode electrically connected to the n-type semiconductor layer, in which the first substrate electrode extends from an upper surface of the substrate facing the light emitting sources to a lower surface thereof and is electrically connected to the p-type electrode, the first substrate electrode including an upper portion having a substantially flat top surface and disposed on the upper surface of the substrate and a lower portion disposed on the lower surface of the substrate.