Micro-LED Chip Tray With Nozzle Array for Uniform Self-Assembly
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Solution Overview
Problem
The transfer of micro-sized semiconductor light emitting devices for large-screen displays is challenging due to difficulties in assembly and non-uniform distribution, leading to low efficiency and high costs.
Innovation Solution
A chip tray system utilizing magnetic and electric fields to uniformly supply and assemble semiconductor light emitting devices on a substrate, enabling high-speed, low-cost transfer and assembly by using a tray unit with electromagnets and nozzles to align devices at predetermined intervals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer micro-LEDs, then large-screen display efficiency is improved, but uniform distribution and positioning precision deteriorate
Solution Approach 1:
The chip tray is divided into multiple regions with different functions: a first region for accommodating micro-LEDs and a second region for accommodating nozzles. This segmentation allows independent optimization of each region, enabling high-speed transfer while maintaining precise positioning through dedicated nozzle arrays in the second region that correspond to specific micro-LED locations.
Solution Approach 2:
The nozzles in the second region act as intermediaries between the micro-LEDs in the first region and the target substrate. These nozzles selectively pick up and place micro-LEDs at precise locations, mediating the transfer process to achieve both high efficiency and positioning precision that pure self-assembly cannot provide.
2Manufacturing precision
If conventional transfer methods are used, then positioning precision is maintained, but productivity and transfer speed deteriorate
Solution Approach 1:
The invention merges the advantages of self-assembly (high throughput) with controlled placement (precise positioning) by combining a fluidic environment for bulk micro-LED accommodation with a structured nozzle array for selective transfer. This merging enables parallel processing of multiple micro-LEDs while maintaining positioning accuracy.
Solution Approach 2:
The chip tray is tilted at a specific angle relative to the substrate, creating a spatial dimension that facilitates gravitational assistance for micro-LED movement while allowing nozzles to access and transfer devices at precise locations. This angular arrangement adds a dimensional element that resolves the speed-precision trade-off.
3Quantity of substance
If micro-LEDs are supplied in large quantities, then display area coverage is improved, but uniform distribution deteriorates
Solution Approach 1:
The chip tray is designed with non-uniform characteristics: the first region has varying depth or structure to prevent clumping and promote uniform distribution of large quantities of micro-LEDs, while the second region with nozzles provides localized controlled release. This local quality differentiation enables both high quantity and uniform distribution.
Solution Approach 2:
The system dynamically adjusts the transfer process by selectively activating nozzles based on real-time detection of micro-LED positions and substrate requirements. This dynamic control ensures uniform distribution even when supplying large quantities of micro-LEDs, preventing overcrowding and maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-efficiency, low-cost assembly of large numbers of semiconductor light emitting devices on a large-area substrate, minimizing non-specific assembly and facilitating uniform distribution across the substrate.
Implementation Method 1
the tray unit can include a plurality of electromagnets disposed on the tray unit at predetermined intervals and configured to vary strength of the magnetic field
Implementation Method 2
a nozzle unit disposed on the tray unit and supplying the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit, the nozzle unit including holes formed at predetermined intervals
Data Source
AI summary
The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.