MicroLED Self-Assembly Chuck With Gas Microholes for Warpage Control
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Solution Overview
Problem
Current methods for manufacturing large-screen microLED displays face challenges such as low transfer yields and assembly yield deterioration due to issues like warpage of substrates and non-uniform magnetic fields, which affect the self-assembly process of semiconductor light-emitting diodes.
Innovation Solution
A device for self-assembling semiconductor light-emitting diodes using a substrate chuck with microholes for gas management and a combination of electric and magnetic fields to precisely position and assemble microLEDs on a substrate, improving yield and reliability by controlling gas flow and substrate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used for microLED transfer, then large-scale display manufacturing becomes feasible, but assembly yield deteriorates due to substrate warpage and non-uniform magnetic fields
Solution Approach 1:
The patent applies parameter changes by adjusting the magnetic field strength and distribution parameters to achieve uniform microLED assembly across large-area substrates. The magnetic field parameters are optimized to compensate for substrate warpage effects, maintaining consistent assembly yield across the entire substrate surface.
Solution Approach 2:
The patent implements preliminary action by pre-compensating for substrate warpage through adaptive magnetic field adjustment before the self-assembly process begins. The system pre-calibrates the magnetic field distribution based on detected substrate geometry, ensuring uniform assembly conditions are established before microLED placement commences.
2Area of stationary object
If large-area substrates are used for microLED displays, then display screen size increases, but substrate warpage occurs affecting assembly precision
Solution Approach 1:
The patent implements feedback control by continuously detecting substrate position and orientation during the self-assembly process, then dynamically adjusting the magnetic field parameters to compensate for detected warpage. This closed-loop control system maintains precise microLED placement accuracy despite large substrate area-induced deformations.
Solution Approach 2:
The patent applies dynamics by making the magnetic field configuration adaptive and dynamic rather than static. The system continuously adjusts magnetic field strength and distribution in response to real-time substrate deformation measurements, enabling precise assembly on large-area flexible substrates that undergo warpage during processing.
3Device complexity
If non-uniform magnetic fields are present during self-assembly, then assembly process becomes simpler, but microLED positioning accuracy decreases
Solution Approach 1:
The patent applies parameter changes by systematically varying magnetic field parameters (strength, gradient, distribution) across different regions of the substrate to achieve uniform positioning accuracy. The magnetic field parameters are dynamically adjusted based on spatial position and substrate characteristics, transforming a potentially non-uniform field into a controlled, uniform assembly environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the self-assembly yield and reliability of microLED placement on large-area substrates, minimizing warpage effects and ensuring uniform assembly, thereby facilitating the production of high-quality large-screen displays.
Implementation Method 1
the substrate support part includes microholes for sucking a gas present between the fluid and the substrate or injecting a gas into between the fluid and the substrate
Implementation Method 2
an electrode connection part connected to the assembly electrode formed on the substrate to generate the electric field
Implementation Method 3
a device for self-assembling semiconductor light-emitting diodes for placing semiconductor light-emitting diodes at a predetermined position on a substrate accommodated in an assembly chamber accommodating a fluid by using an electric field and a magnetic field
Data Source
AI summary
Discussed is a device for self-assembling semiconductor light-emitting diodes for placing the semiconductor light-emitting diodes at predetermined positions on a substrate by using an electric field and a magnetic field, the substrate being accommodated in an assembly chamber accommodating a fluid, the device including a substrate chuck configured to dispose the substrate at an assembly position, wherein the substrate chuck includes a substrate support part configured to support the substrate on which an assembly electrode is formed, a rotating part configured to support the substrate support part, and a controller configured to control driving of the substrate chuck, wherein the substrate support part includes micro-holes for injecting a gas between the fluid and the substrate, and wherein the controller controls whether the gas is injected through the micro-holes according to whether the substrate is raised or lowered.