Micro-LED Display Cover Structure for Seam Hiding and ESD Protection
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Solution Overview
Problem
Existing display apparatuses face challenges such as slow response time, high power consumption, and susceptibility to screen burn-in, particularly in liquid crystal panels and OLED panels.
Innovation Solution
A display apparatus and manufacturing method utilizing a micro-LED panel with inorganic light emitting diodes mounted on a substrate, featuring a Thin Film Transistor (TFT) layer, an anisotropic conductive layer, and a front and side cover configuration to prevent seam recognition and protect against electrostatic discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If liquid crystal panel is used, then it can display images, but it has slow response time and high power consumption
Solution Approach 1:
The patent replaces the liquid crystal mechanism with a micro-LED light emitting mechanism. Instead of using liquid crystal molecules that need to rotate and align (mechanical process), the invention uses inorganic LED chips that directly emit light when electric current is applied, eliminating the slow mechanical response and reducing power consumption significantly.
Solution Approach 2:
The patent changes the fundamental operating parameters from liquid crystal optical modulation to LED light emission. By transitioning to inorganic LED technology with different material properties and emission mechanisms, the system achieves faster response times and lower power consumption while maintaining display functionality.
2Reliability
If OLED panel is used, then it emits light by itself and can be made thin, but it is susceptible to screen burn-in
Solution Approach 1:
The patent uses inorganic LED chips that can be individually replaced if needed, and the modular design allows for easier maintenance and replacement compared to OLED panels. The LED chips have longer operational lifetimes and are more resistant to burn-in phenomena.
Solution Approach 2:
The patent employs inorganic LED materials with different compositional characteristics than organic OLED materials. The inorganic semiconductor materials used in LEDs provide superior stability and resistance to degradation, eliminating the screen burn-in issue inherent in OLED technology.
3Object-affected harmful factors
If anisotropic conductive layer is used to connect TFT layer to inorganic LEDs, then electrical connection is achieved, but seam may be recognized and electrostatic discharge protection is needed
Solution Approach 1:
The side cover structure serves multiple functions simultaneously: it provides mechanical support, ensures proper positioning of the anisotropic conductive layer, offers electrostatic discharge protection through grounding pathways, and maintains a sleek appearance by hiding seams. This multi-functional design reduces overall device complexity despite the added protective features.
Solution Approach 2:
The side cover acts as an intermediary element between the front cover and the substrate, providing electrostatic discharge protection and structural support. It mediates the electrical and mechanical interactions, protecting sensitive components while maintaining the display's aesthetic appearance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved contrast, response times, energy efficiency, and durability compared to traditional panels, while preventing seam recognition and enhancing electrostatic discharge protection.
Implementation Method 1
an anisotropic conductive layer provided on an upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light emitting diodes
Implementation Method 2
a plurality of inorganic light emitting diodes mounted on the mounting surface of the substrate
Data Source
AI summary
A display module includes a substrate including a mounting surface and a side surface; a Thin Film Transistor (TFT) layer provided on the mounting surface of the substrate; a plurality of inorganic light emitting diodes mounted on the mounting surface of the substrate; an anisotropic conductive layer provided on an upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light emitting diodes; a front cover covering the mounting surface; and a side cover surrounding the side surface. A side end of the front cover extends to a region outside the mounting surface, and the side cover is bonded to a lower surface of the front cover and to the side surface of the substrate which correspond to the region outside of the mounting surface.