Micro-LED Display Frame Thermal Stress Management

A buffer layer is introduced between the metal plate and the substrate to act as an intermediary element. This buffer layer has a coefficient of thermal expansion that is lower than the metal plate but higher than the substrate, allowing it to absorb thermal expansion differences and prevent stress concentration that would damage the substrate while still enabling effective heat dissipation from the metal plate.

The frame structure uses a composite material design with multiple layers including the metal plate, buffer layer, and substrate. Each layer is made of different materials with specific thermal and mechanical properties that complement each other, creating a composite structure that simultaneously achieves good heat dissipation performance and protects the substrate from thermal stress damage.

The frame is segmented into multiple functional layers with different material properties: the metal plate layer provides high heat dissipation capability, the buffer layer provides thermal expansion matching to reduce stress, and the substrate layer provides structural stability. This segmentation allows each layer to optimize its specific function without compromising the overall system performance.

The thermal management function is separated from the structural function by introducing an intermediate buffer layer in the vertical dimension. The metal plate handles heat dissipation in one functional dimension, the buffer layer handles thermal expansion compensation in another dimension, and the substrate handles structural support, allowing independent optimization of heat dissipation and stress reduction.