Micro-LED Display Panel Layout for High-PPI Driver Integration
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Solution Overview
Problem
Micro LED display panels face limitations in high pixel per inch (PPI) development due to the complexity of array pixel circuits and high drive current sensitivity, which occupies significant space and reduces resolution.
Innovation Solution
A display panel design featuring a first substrate with signal lines and light-emitting assemblies, where each assembly includes a second substrate with a drive assembly and light-emitting chip, with the drive assembly electrically connected to the signal lines through a connection portion, reducing the area occupied by the driver circuit and enhancing resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If array pixel circuits are used to drive light-emitting chips in micro-LED display panels, then the display panel can be driven and controlled, but the array pixel circuits occupy significant area and reduce the resolution
Solution Approach 1:
The patent extracts the drive assembly from the traditional array pixel circuit structure and relocates it to a separate substrate. This separation removes the bulky driver circuit from the display panel area, directly resolving the contradiction between resolution and driver circuit area occupation.
Solution Approach 2:
The patent transitions the drive assembly from a planar integration on the same substrate to a three-dimensional configuration where the drive assembly is mounted on a separate substrate positioned adjacent to the light-emitting chip. This spatial reorganization reduces the in-plane area occupation while maintaining electrical connectivity through vertical connections.
2Ease of operation
If array pixel circuits are used to drive light-emitting chips, then the display panel can be controlled, but the complexity of the circuit increases
Solution Approach 1:
The patent extracts the complex array pixel circuit from the display panel structure and places it in a separate drive assembly on a different substrate. This separation simplifies the overall system architecture by isolating the control complexity into a dedicated module, making the display panel itself less complex while maintaining full control capability.
3Reliability
If traditional connection structures are used between drive assembly and signal lines, then electrical connection can be established, but the overall size of the display panel increases
Solution Approach 1:
The patent implements a nested configuration where the connection portion is integrated within the second substrate structure, and the drive assembly is positioned adjacent to the light-emitting chip with minimal spacing. This nesting approach allows electrical connections to be established through compact vertical and lateral pathways, reducing the overall footprint while maintaining reliable electrical connectivity.
Data Source
AI summary
Provided are a display panel, a preparation method thereof, and a display device. The display panel includes a first substrate and light-emitting assemblies. The first substrate includes a plurality of signal lines. The light-emitting assemblies are located on a side of the first substrate. A light-emitting assembly includes a second substrate, a drive assembly, a light-emitting chip, and connection portions. The light-emitting chip is located on a side of the second substrate facing away from the first substrate. The drive assembly and the light-emitting chip are located on the same side of the second substrate. The drive assembly is configured to drive the light-emitting chip to emit light. The drive assembly is electrically connected to a signal line through the connection portion. The connection portion is at least partially located on a side of the second substrate facing the first substrate.