MicroLED Assembly Electrode Structure for Higher Self-Assembly Yield
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Solution Overview
Problem
The transfer yield of semiconductor light-emitting elements in display devices is low due to difficulties in accurately positioning and securely attaching millions of microLEDs on large-scale substrates, especially when using self-assembly methods.
Innovation Solution
A display device design featuring a base with assembly electrodes made of Al, a dielectric layer, and barrier ribs with holes for semiconductor light-emitting elements, where an electrochemical reaction produces AlOx to enhance adhesion, allowing direct self-assembly on a wiring substrate and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer semiconductor light-emitting elements, then large-scale display production becomes feasible, but transfer yield remains low due to positioning and attachment difficulties
Solution Approach 1:
The patent applies preliminary action by pre-forming protrusions on the substrate before self-assembly. These protrusions are prepared in advance to provide mechanical interlocking features that ensure reliable attachment of semiconductor light-emitting elements during self-assembly, thereby improving transfer yield while enabling large-scale production
Solution Approach 2:
The patent introduces an intermediary mechanism by using fluid medium to facilitate self-assembly while incorporating protrusions that act as intermediaries for mechanical attachment. The protrusions serve as mediating structures between the substrate and the light-emitting elements, ensuring reliable bonding during the self-assembly process in fluid
2Adaptability or versatility
If additional transfer process is used in hybrid-transfer method, then structure flexibility for self-assembly is improved, but process complexity increases
Solution Approach 1:
The patent merges the self-assembly approach with direct transfer methodology by integrating protrusion-based attachment into the self-assembly process. This combination eliminates the need for separate additional transfer processes while maintaining structural flexibility, thereby reducing process complexity while preserving adaptability
3Productivity
If semiconductor light-emitting elements are directly assembled on final substrate, then process efficiency is improved, but attachment reliability may be compromised
Solution Approach 1:
The patent applies preliminary action by pre-forming protrusions on the final substrate before direct self-assembly of light-emitting elements. These protrusions are prepared in advance to provide mechanical interlocking features that ensure reliable attachment during direct assembly, thereby maintaining both process efficiency and attachment reliability
Solution Approach 2:
The patent replaces conventional mechanical attachment systems with a self-assembly mechanism enhanced by protrusion-based mechanical interlocking. This substitution allows direct assembly on the final substrate to proceed efficiently while the protrusions provide the necessary attachment reliability through geometric interlocking rather than complex mechanical fastening
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the transfer yield of semiconductor light-emitting elements by minimizing loss during post-processing and simplifying the manufacturing process, enabling more efficient large-scale display production.
Implementation Method 1
an electrochemical reaction produces AlOx to enhance adhesion
Implementation Method 2
seating the semiconductor light-emitting elements at preset positions on the assembly substrate using a magnetic field and an electric field
Data Source
AI summary
A display device according to the present invention is characterized by comprising: a base part; assembly electrodes extending in one direction and formed on the base part; a dielectric layer formed so as to cover the assembly electrodes; a barrier rib part stacked on the dielectric layer while forming holes so as to overlap the assembly electrodes; semiconductor light-emitting elements disposed inside the holes; and wiring electrodes electrically connected to the semiconductor light-emitting elements, wherein the assembly electrodes are formed so as to include Al, and the holes include AlOx.