Micro-LED Electrode Bridge Structure for Reliable Display Interconnects
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Solution Overview
Problem
Display devices using ultra-small light-emitting diodes (LEDs) face challenges in achieving improved reliability and manufacturing efficiency, particularly in the connection and interconnection of components and materials, particularly in the integration of an anode and cathode structures.
Innovation Solution
The display device incorporates a cathode and an anode disposed on a pixel circuit layer with bridge electrodes and undercuts, along with an adhesive layer to enhance electrical connectivity and structural integrity, utilizing a planarization layer to form undercuts along the edges of the anode and cathode, and bridge electrodes to ensure proper electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If ultra-small LEDs are used as light-emitting elements, then display device miniaturization and integration are improved, but manufacturing reliability and electrical connection stability deteriorate
Solution Approach 1:
The patent divides the electrode structure into multiple segments: separate anode and cathode, bridge electrodes for electrical connection, adhesive layers for bonding, and planarization layers for surface平整度. This segmentation allows each component to be optimized independently, improving manufacturing reliability while maintaining miniaturization.
Solution Approach 2:
The patent forms bridge electrodes and adhesive layers in advance before final assembly. The planarization layer is prepared beforehand to ensure proper surface geometry. These preliminary actions prevent connection issues and improve manufacturing yield when using ultra-small LEDs.
2Reliability
If complex anode and cathode connection structures are implemented, then electrical connectivity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent introduces bridge electrodes as intermediary elements between the anode/cathode and the light-emitting elements. These bridge electrodes simplify the connection geometry and provide reliable electrical pathways without requiring complex direct bonding arrangements.
Solution Approach 2:
The patent utilizes vertical layering (z-dimension) with multiple stacked layers including planarization layers, adhesive layers, and bridge electrodes. This dimensional approach allows electrical connections to be established through vertical pathways rather than complex lateral routing, reducing overall structural complexity.
3Strength
If adhesive layers are used to bond components, then structural integrity is improved, but manufacturing precision and alignment control become more challenging
Solution Approach 1:
The patent forms the planarization layer and adhesive layer in advance with controlled thickness and geometry. This preliminary preparation establishes precise reference surfaces and bonding interfaces before component assembly, making alignment easier and more repeatable.
Solution Approach 2:
The adhesive layer is applied locally at specific bonding interfaces rather than uniformly across the entire device. This localized application allows precise control of adhesive placement and thickness at critical connection points, improving alignment precision while maintaining structural integrity.
Data Source
AI summary
A display device includes a cathode disposed on a pixel circuit layer, a first anode, a first light-emitting element including a first emission stack, a first anode connection electrode, a first cathode connection electrode, an adhesive layer disposed between the first anode and the first anode connection electrode and between the cathode and the first cathode connection electrode, a first anode bridge electrode in contact with the first anode and the first anode connection electrode, and a cathode bridge electrode in contact with the cathode and the first cathode connection electrode. A planarization layer forming an uppermost layer of the pixel circuit layer includes a first anode undercut formed along an edge of the first anode between the planarization layer and a lower surface of the first anode, and a cathode undercut formed along an edge of the cathode between the planarization layer and a lower surface of the cathode.