Micro-LED Electrode Stack With Buffer Layer Against Oxidation
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Solution Overview
Problem
The electrode layer of micro light-emitting diode (Micro-LED) backplanes is prone to oxidation during manufacturing, leading to yield decrease and quality reduction.
Innovation Solution
The array substrate includes a metal sub-layer and a conductive sub-layer with a first buffer metal layer sandwiched between them, where the conductive sub-layer is a copper-nickel alloy, providing oxidation resistance and improving the electrode layer's morphology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a simple metal electrode layer is used, then the manufacturing process is simple and cost is low, but the electrode layer is prone to oxidation resulting in yield decrease and quality reduction
Solution Approach 1:
The electrode layer is constructed as a composite structure with a copper sub-layer providing electrical conductivity and a copper-nickel alloy sub-layer providing oxidation resistance. This composite material approach allows the electrode to simultaneously achieve low cost, high conductivity, and oxidation resistance without requiring complex additional protective structures.
Solution Approach 2:
The copper-nickel alloy sub-layer acts as an intermediary protective barrier between the copper sub-layer and the oxidizing environment. This intermediate layer prevents direct contact between oxygen and the copper, thereby preventing oxidation while maintaining the electrical functionality of the electrode.
2Manufacturing precision
If the electrode layer structure is simplified, then manufacturing is easier, but adhesion and morphology are compromised
Solution Approach 1:
The two-sub-layer composite structure enables simultaneous optimization of morphology and adhesion. The copper sub-layer provides excellent electrical conductivity and cost-effectiveness, while the copper-nickel alloy sub-layer enhances surface morphology and adhesion properties. This composite approach achieves high manufacturing precision without significantly complicating the fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the yield and quality of the array substrate by preventing oxidation of the electrode layer, ensuring better adhesion and reducing defects.
Implementation Method 1
the conductive sub-layer is a copper-nickel alloy, providing oxidation resistance and improving the electrode layer's morphology
Data Source
AI summary
A light-emitting substrate and a backlight module are provided, the light-emitting substrate includes a base substrate; a metal wiring layer; a first planarization layer; an electrode layer; the electrode layer including a metal sub-layer and a conductive sub-layer stacked; material of the metal sub-layer include metal or metal alloy; the conductive sub-layer covers the metal sub-layer; a second planarization layer at a side of the electrode layer a functional device layer at a side of the second planarization layer and including a plurality of functional devices electrically connected to the electrode layer; the electrode layer includes a first buffer metal layer between the metal sub-layer and the conductive sub-layer; material of the first buffer metal layer is any one of or a mixture of more than one of molybdenum, molybdenum-niobium alloy, molybdenum-tungsten alloy, molybdenum-nickel-titanium alloy and molybdenum-magnesium-aluminum alloy.