Display Backboard Connection Structure for Micro-LED Bonding Overflow
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Solution Overview
Problem
The challenge in Micro-LED display technology is to improve the bonding efficiency and reliability of Micro-LEDs to their corresponding driving electrodes on the display backboard, particularly due to the small pitch between adjacent Micro-LEDs which can lead to short circuits.
Innovation Solution
A display backboard with a connection structure that includes a conductive component and a restriction component is used. The conductive component is formed on the driving electrode with a cross-sectional area that decreases as it approaches the substrate surface, and the restriction component protrudes from the electrode to restrict the bonding material, preventing overflow and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the pitch between adjacent Micro-LEDs is reduced to increase resolution, then the resolution is improved, but the risk of short circuits increases due to bonding material overflow
Solution Approach 1:
The connection structure is segmented into distinct functional components: a conductive component for electrical connection and a restriction component for bonding material containment. This segmentation allows the bonding material to be confined to specific regions, preventing overflow to adjacent pixels even at reduced pitches, thereby maintaining reliability while enabling higher resolution
Solution Approach 2:
The restriction component acts as an intermediary structure between adjacent driving electrodes. It physically separates the bonding material zones of neighboring Micro-LEDs, preventing direct contact between bonding materials of adjacent pixels. This intermediary structure enables smaller pitch distances without increasing short circuit risk
2Strength
If the bonding area is increased to improve bonding strength, then the bonding reliability is improved, but the bonding material may overflow to adjacent electrodes causing short circuits
Solution Approach 1:
The connection structure implements local quality differentiation: the conductive component provides a localized bonding area for strong electrical connection, while the restriction component creates a localized barrier to contain bonding material. This allows sufficient bonding strength at the connection point without increasing the overall bonding material spread area, preventing overflow to adjacent electrodes
Solution Approach 2:
The restriction component extends vertically from the driving electrode surface, adding a height dimension to the connection structure. This vertical extension creates a physical barrier that confines bonding material laterally, allowing adequate bonding area on the surface without horizontal overflow to adjacent electrodes
Data Source
AI summary
A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.