Micro-LED Panel Electrode Sharing for Higher PPI Layouts
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Solution Overview
Problem
The existing Micro-LED display panels face limitations in achieving higher resolution due to the accuracy issues in the massive transfer process, which affects the distance between light-emitting components, making it difficult to meet the requirements for higher Pixels Per Inch (PPI).
Innovation Solution
The display panel design includes a drive substrate with pads and a bonding layer, where the second electrodes of adjacent light-emitting components are close to each other, sharing a common bonding layer or pad, allowing them to be connected to the same signal, thereby reducing the distance between light-emitting components and improving resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If massive transfer is used to bond light-emitting components to the drive substrate, then the light-emitting components can be arranged in an array to form the display panel, but the distance between light-emitting components is limited by the accuracy of massive transfer, making it difficult to achieve higher resolution
Solution Approach 1:
The patent merges adjacent second electrodes of different light-emitting components by making them close to each other and sharing a common bonding layer or bonding pad. This merging approach reduces the overall distance between light-emitting components and enables higher resolution display panels by overcoming the limitations of massive transfer accuracy
2Measurement precision
If the distance between light-emitting components is reduced to achieve higher resolution, then PPI requirements can be met, but the accuracy of massive transfer becomes insufficient to maintain proper spacing and alignment
Solution Approach 1:
Adjacent second electrodes are merged by positioning them close to each other and bonding them through a shared bonding layer or bonding pad. This merging strategy allows the electrodes to be electrically connected while maintaining compact spacing between light-emitting components, thereby achieving higher resolution without being constrained by massive transfer accuracy
Solution Approach 2:
The bonding layer or bonding pad serves multiple functions: it bonds the second electrodes to the drive substrate and simultaneously electrically connects adjacent second electrodes that are close to each other. This multi-functionality enables the structure to achieve both mechanical support and electrical connectivity while maintaining reduced component spacing
Data Source
AI summary
A display panel and a display device are provided. The display panel includes a drive substrate, a bonding layer, and multiple light-emitting components. The drive substrate includes multiple sets of pads. Each set of pads includes a first pad and a second pad. The bonding layer is arranged on the multiple sets of pads. Each light-emitting component includes a semiconductor light-emitting layer, a first electrode, and a second electrode. The first electrode and the second electrode are arranged at opposite ends of the semiconductor light-emitting layer. The first electrode is electrically connected to a corresponding first pad through the bonding layer. The second electrode is electrically connected to a corresponding second pad through the bonding layer. The second electrodes of the adjacent light-emitting components are close to each other. The second electrodes close to each other are shorted through the same bonding layer and/or the same second pad.