Vertical Micro-LED Electrode Layout for Etch-Protected Pad Connections
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Solution Overview
Problem
The formation of a planar layer or conductive layer during the manufacturing process of vertical Micro-LED display devices damages the connection between the lower electrode and the corresponding pad, leading to poor reliability.
Innovation Solution
A display device design that includes a conductive layer disposed on the upper surface of an encapsulation layer, electrically connected to the second electrode of the light-emitting elements, which protects the electrical connection between the first electrode and the first pad from damage during the formation of the conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planar layer or conductive layer is formed during the manufacturing process of vertical Micro-LED display devices, then the electrical connection between the second electrode and the circuit substrate is established, but the etchant used to pattern the layer damages the connection between the lower electrode and the corresponding pad
Solution Approach 1:
The patent applies preliminary action by forming the planar layer and establishing the first electrical connection between the lower electrode and pad BEFORE introducing the etchant for patterning the conductive layer. This sequence ensures the connection is already in place and protected before any potentially damaging chemical processes occur during subsequent manufacturing steps.
Solution Approach 2:
The patent implements beforehand cushioning by creating a protective planar layer structure that cushions and protects the delicate electrical connection between the lower electrode and pad from the damaging effects of the etchant. This protective layer acts as a buffer that prevents direct exposure of the connection to harmful chemicals during the patterning process.
2Ease of manufacture
If the etchant is used to pattern the conductive layer, then the conductive layer is formed to connect the upper electrode to the circuit substrate, but the connection between the lower electrode and the corresponding pad is damaged
Solution Approach 1:
The patent applies preliminary action by completing the formation of the lower electrode connection and applying the planar layer protection BEFORE the etching process is used to pattern the conductive layer. This ensures the vulnerable connection is already established and shielded before the etchant is introduced to create the conductive layer patterns.
Solution Approach 2:
The patent uses the planar layer as an intermediary protective element that mediates between the etchant and the lower electrode connection. This intermediary layer allows the etching process to proceed for conductive layer formation while preventing the etchant from directly contacting and damaging the electrical connection below.
Data Source
AI summary
A display device includes a circuit substrate, a plurality of first pads, a plurality of light-emitting elements, an encapsulation layer and a conductive layer. The plurality of first pads is disposed on the circuit substrate. The plurality of light-emitting elements is disposed above the circuit substrate, and each light-emitting element includes a first electrode, a second electrode, and a light-emitting stack located between the first electrode and the second electrode, wherein the first electrodes of the plurality of light-emitting elements are disposed respectively between the light-emitting stacks of the plurality of light-emitting elements and the circuit substrate and electrically connected to the plurality of first pads respectively. The encapsulation layer is disposed on the circuit substrate and between the light-emitting elements. The conductive layer is disposed at an upper surface of the encapsulation layer and electrically connected to the second electrode.