Micro-LED Eutectic Bond Structure for Higher Repair Yield
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Solution Overview
Problem
The existing methods for manufacturing micro-light-emitting element display devices face issues with low yield in light-emitting element repair due to incomplete removal of connecting materials, leading to unsuccessful connections and unsatisfactory repair outcomes.
Innovation Solution
The proposed solution involves a light-emitting device design with a circuit substrate, light-emitting elements, metal patterns, connectors, and eutectic patterns, where the eutectic patterns are used to facilitate the removal of non-functional light-emitting elements and their connections, allowing for efficient repair without the need for conductive glue, by utilizing specific materials like titanium, molybdenum, copper, indium, and silver, and a method for transferring new elements using a carrier with an adhesive layer and thermal treatment to form new eutectic and connector patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mass transfer technology is used to manufacture micro-light-emitting element display devices, then large numbers of elements can be transferred at one time, but some elements fail to light up and repair yield is low
Solution Approach 1:
The connecting material layer is segmented into a first connecting material layer and a second connecting material layer. The first layer enables initial attachment and electrical connection, while the second layer is designed to be removable during repair. This segmentation allows failed elements to be selectively removed without damaging surrounding structures, thereby improving repair yield while maintaining mass transfer efficiency.
Solution Approach 2:
The patent extracts the second connecting material layer specifically for removal during repair processes. By designing this layer to be removable while leaving the first connecting material layer intact, the patent enables successful replacement of failed light-emitting elements without compromising the overall array structure, thus resolving the low repair yield issue.
2Ease of repair
If conductive glue is used to mount new light-emitting elements for repair, then replacement is possible, but incomplete removal of connecting material prevents successful connection
Solution Approach 1:
The connecting material is divided into two distinct layers with different functions. The first layer provides structural support and electrical connection, while the second layer is designed for easy removal. This segmentation enables precise control over what remains after repair, ensuring clean connections without residual material interference.
Solution Approach 2:
The second connecting material layer is specifically designed to be extractable during repair. By removing only this layer while retaining the first layer, the patent achieves complete removal of removable connecting material, preventing connection failures and improving manufacturing precision in repair operations.
3Reliability
If connecting material is removed completely during repair, then new elements can be connected successfully, but additional materials and steps are required
Solution Approach 1:
By segmenting the connecting material into removable and non-removable layers, the patent enables complete removal of necessary material without requiring additional cleaning steps or materials. The layered structure itself provides the solution, reducing overall process complexity while ensuring connection success.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the repair process, improves the yield of light-emitting element repair by enabling the removal of non-functional elements and their connections without additional materials, ensuring successful connections and enhancing the overall efficiency of the repair procedure.
Implementation Method 1
a plurality of eutectic patterns. The plurality of eutectic patterns is disposed between the plurality of light-emitting elements and the plurality of connectors respectively
Implementation Method 2
a method for transferring new elements using a carrier with an adhesive layer and thermal treatment to form new eutectic and connector patterns
Data Source
AI summary
A light-emitting device includes a circuit substrate; a plurality of light-emitting elements disposed over the circuit substrate; a plurality of metal patterns disposed between the plurality of light-emitting elements and the circuit substrate respectively; a plurality of connectors disposed between the plurality of light-emitting elements and the plurality of metal patterns respectively; and a plurality of eutectic patterns disposed between the plurality of light-emitting elements and the plurality of connectors respectively, wherein a first spacing exists between a first light-emitting element of the plurality of light-emitting elements and the circuit substrate, a second spacing exists between a second light-emitting element of the plurality of light-emitting elements and the circuit substrate, and a difference between the first spacing and the second spacing is equal to a thickness of the eutectic pattern.