Micro-LED Grid Structure for Optical Crosstalk Isolation
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Solution Overview
Problem
Micro-LED displays face challenges in manufacturing cost-effectiveness and maintaining efficiency and imaging quality due to complex designs required to minimize optical crosstalk between pixels, especially in projection applications.
Innovation Solution
An optical projection device with a grid structure that laterally surrounds and electrically interconnects semiconductor mesas, using conductive material to block optical crosstalk while simplifying electrical connections, allowing for individually controllable LEDs with reduced size and improved pixel density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional solutions are used to separate individual pixels, then optical crosstalk is reduced to some extent, but device complexity increases significantly
Solution Approach 1:
The device is segmented into discrete pixel elements with individual semiconductor mesas separated by grid structures. Each pixel is independently defined and isolated, allowing optical crosstalk reduction through physical segmentation while maintaining manufacturing simplicity through repetitive modular units.
Solution Approach 2:
The grid structure acts as an intermediary element between adjacent semiconductor mesas. This intermediate structure provides both optical isolation to block crosstalk and electrical connection through conductive material, resolving the contradiction by introducing a mediating component that serves dual functions.
2Manufacturing precision
If complex optical path designs are used to minimize crosstalk, then imaging quality is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The grid structure merges optical isolation and electrical connection functions into a single integrated component. By combining these two functions that were previously addressed by separate complex structures, the design achieves high imaging quality while simplifying manufacturing and reducing costs.
Solution Approach 2:
The grid structure serves multiple functions simultaneously: it provides optical isolation between pixels, establishes electrical connections through conductive material, and defines pixel boundaries. This multi-functionality eliminates the need for separate complex structures for each function, reducing overall device complexity and manufacturing cost.
3Quantity of substance
If LED cell size is reduced to increase pixel density, then pixel density is improved, but optical isolation between pixels becomes more difficult
Solution Approach 1:
The solution moves from two-dimensional pixel arrangement to three-dimensional structure by implementing vertical grid structures that laterally surround semiconductor mesas. This dimensional transition allows effective optical isolation in the lateral direction even when pixels are densely packed, enabling high pixel density without compromising optical isolation.
Solution Approach 2:
The grid structure employs composite material design combining dielectric material for optical isolation and conductive material for electrical connection. This composite approach allows the same structure to address both optical crosstalk prevention and electrical connectivity, enabling dense pixel packing while maintaining performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces optical crosstalk and electrical resistance, enabling high pixel density and easy implementation of multi-color micro-displays, while reducing LED cell size by about 50% and improving current distribution, thus enhancing energy efficiency and manufacturing simplicity.
Implementation Method 1
the grid structure is configured to block optical crosstalk between light emitted by the LEDs
Implementation Method 2
the grid structure is configured to block optical crosstalk between light emitted by the LEDs
Implementation Method 3
the grid structure comprises a conductive material that electrically interconnects the n-type material of the semiconductor mesas
Data Source
AI summary
An optical projection device and a method of producing the optical projection device are described. The optical projection device includes: a plurality of LEDs (light-emitting diodes), the LEDs each including a semiconductor mesa laterally spaced apart from one another by a grid structure. Each of the semiconductor mesas includes an n-type material and a p-type material adjoining at least partly the n-type material. The grid structure at least partly laterally surrounds at least the n-type material of each of the semiconductor mesas. The grid structure includes a conductive material that electrically interconnects the n-type material of the semiconductor mesas. The grid structure is configured to block optical crosstalk between light emitted by the LEDs.