Micro-LED Assembly Hole Structure for Precise Dielectrophoretic Placement
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Solution Overview
Problem
The existing self-assembly method for aligning light emitting devices on a substrate faces challenges such as assembling failure and reduced efficiency due to strong electric fields at positions other than the bottom part of the assembling hole, leading to incorrect assembly and detachment of light emitting devices.
Innovation Solution
The proposed solution involves modifying the structure of the assembling hole by providing a first hole on a second assembling wire with a narrower width, which intensifies the electric field at the bottom part and rapidly reduces it upward, preventing incorrect assembly and enhancing the assembling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional assembling hole structure is used with uniform width, then the manufacturing process is simple, but the electric field is not sufficiently concentrated at the bottom part, causing assembling failure and reduced efficiency
Solution Approach 1:
The assembling hole is divided into multiple sections with different widths: a first hole portion with a first width and a second hole portion with a second width smaller than the first width. This segmentation concentrates the electric field at the bottom part (first hole portion) while maintaining structural functionality, thereby improving assembling efficiency without excessive complexity
Solution Approach 2:
The hole structure has non-uniform width with different local properties: the first hole portion has a larger width for receiving the light emitting device, while the second hole portion has a smaller width to concentrate the electric field. This local quality variation ensures reliable assembly at the bottom while controlling field distribution
2Reliability
If the electric field is strongly generated at positions other than the bottom part of the assembling hole, then the light emitting device can be assembled, but incorrect devices may be assembled and cannot be detached
Solution Approach 1:
The electric field strength is made non-uniform through the variable width hole structure. The first hole portion (bottom) with larger width generates strong electric field for reliable assembly, while the second hole portion (upper) with smaller width generates weak or no electric field, preventing incorrect assembly and allowing only properly sized devices to be assembled
Solution Approach 2:
Instead of having strong electric field throughout the hole and relying on mechanical fit, the invention inverts the approach by having strong electric field only at the bottom portion and weak/zero field at upper portions, using electric field distribution to enforce assembly precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that only the correctly sized light emitting device is assembled into the hole, preventing assembling failures and improving the overall efficiency of the process, while also minimizing signal distortion and maintaining image quality.
Implementation Method 1
An electric field is generated between the assembling wires 2 and 3 as a voltage is applied to the assembling wires 2 and 3. The light emitting devices 6 and 7 are assembled to the assembling hole 6 by dielectrophoretic force formed by the electric field.
Implementation Method 2
numerous light emitting devices are introduced into a bath having a fluid to move to pixels of the substrate, as to magnetic substance moves
Data Source
AI summary
Discussed is a display device including a substrate, a plurality of first assembling wires on the substrate, a plurality of second assembling wires on the substrate, and separated from the plurality of first assembling wires; a first insulating layer disposed on the substrate, wherein a first hole is located on each of the plurality of second assembling wires, respectively, and wherein the first hole is not located on each of the plurality of first assembling wires; and a semiconductor light emitting device in the first hole.