Micro-LED Display Assembly With Insulating Layers Against Shorts

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Solution Overview

Problem

In display devices, subminiature light emitting diodes (LEDs) are prone to short circuits when closely packed, leading to defects and reduced durability due to the lack of effective insulation between adjacent LEDs.

Innovation Solution

A method of manufacturing a display device with a substrate having a display area and non-display area, where each pixel includes a light emitting element with a core-shell structure, an insulating film covering the electrode layer, and strategically placed contact electrodes to prevent short circuits, using a second insulating layer to expose ends of the LEDs and etch the insulating film to expose semiconductor layers for contact, and additional insulating patterns to enhance isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If light emitting diodes are disposed close to each other to increase pixel density, then the display resolution is improved, but short circuits occur between adjacent light emitting diodes causing defects

Engineering Contradiction:
Improvepixel densityVSAvoidshort circuit prevention
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

An insulating film is introduced as an intermediary layer between adjacent light emitting diodes. This insulating film fills the gaps between LEDs and prevents direct contact, thereby eliminating short circuits while allowing the LEDs to be disposed closely together for high pixel density displays

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The insulating film is selectively applied in the gap regions between adjacent light emitting diodes, providing localized insulation exactly where needed. This allows the LEDs to maintain close spacing for high density while ensuring reliable electrical isolation in critical areas

Inventive Principle:
Principle #3Local quality

2Productivity

If light emitting diodes are disposed close to each other to increase pixel density, then the display resolution is improved, but manufacturing complexity increases due to alignment requirements

Engineering Contradiction:
Improvepixel densityVSAvoidalignment complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The insulating film is formed in advance before the light emitting diodes are fully assembled or connected. This preliminary formation of the insulating structure simplifies subsequent assembly steps and reduces alignment complexity during manufacturing

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The insulating film serves as a mediator that simplifies the manufacturing process by providing a pre-formed isolation structure, reducing the need for complex alignment procedures during LED assembly

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP3855494B1Method for manufacturing a display device
Publication Date: 2024.12.18 SAMSUNG DISPLAY CO LTD
  • EP3855494B1 patent drawingFigure 1A~1B
  • EP3855494B1 patent drawingFigure 1C
  • EP3855494B1 patent drawingFigure 2

AI summary

A display device may include: a substrate including a display area and a non-display area; and a plurality of pixels disposed on the display area, and each including a plurality of sub-pixels. Each sub-pixel may include a pixel circuit layer, and a display element layer including at least one light emitting element. The display element layer includes first and second electrodes spaced apart from each other; a first insulating layer disposed between the pixel circuit layer and the light emitting element; and a second insulating layer disposed on an upper surface of the light emitting element and provided in a form of filling space between the first insulating layer and ends of the light emitting element with the second insulating layer. The light emitting element includes a first conductive semiconductor layer, an active layer enclosing at least one side of the first conductive semiconductor layer, a second conductive semiconductor layer enclosing the active layer, an electrode layer enclosing the second conductive semiconductor layer, and an insulating film covering the electrode layer. A portion of the first conductive semiconductor layer and a portion of the electrode layer may not be covered with the insulating film.