Micro-LED Display Stacking With Laser Bonded Pixel Connections

The patent transitions from planar bonding methods (flip-chip or wire bonding) to a vertical stacking architecture where light-emitting elements are stacked above switching elements in the third dimension. This dimensional change allows pixel size reduction while maintaining reliable connections through vertical laser bonding instead of lateral wire bonding.

The patent replaces traditional mechanical bonding methods (flip-chip bonding, wire bonding) with laser-based bonding. The laser bonding process uses optical energy to fuse elements together, eliminating the need for mechanical wire bonds or chip mounting while achieving stronger, more reliable connections at smaller scales.

The patent merges the light-emitting element and switching element into a single stacked structure, eliminating the need for separate die transfer and photolithography processes. The laser bonding process simultaneously achieves alignment and bonding, consolidating multiple complex steps into a single operation.

The patent replaces complex mechanical die transfer and photolithography systems with a laser-based bonding system. The laser process provides direct, precise bonding without requiring photomasks, alignment machinery, or multiple processing steps, significantly simplifying the manufacturing process.

The patent replaces expensive die transfer and photolithography equipment with laser bonding technology. The laser system eliminates the need for photomasks, alignment tools, and complex transfer mechanisms, reducing capital equipment costs and manufacturing expenses while enabling smaller chip sizes.

The patent extracts and removes the expensive die transfer and photolithography steps from the manufacturing process, retaining only the essential laser bonding operation. This extraction eliminates unnecessary complexity and cost while achieving the goal of smaller micro LED chip bonding.