MicroLED Pixel Structure With Light Scattering and Metal Heat Isolation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

MicroLED display screens face challenges in achieving high brightness and fast heat dissipation while maintaining high pixel density, particularly due to limitations in light emitting efficiency and heat dissipation properties of materials used in red light MicroLEDs.

Innovation Solution

The implementation of a MicroLED display screen structure that includes a MicroLED array substrate with pixels comprising a first subpixel and a second subpixel, where a light scattering structure and a light conversion structure are used above the first and second subpixels respectively, and a metal isolation structure is placed between them to enhance light emitting efficiency and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If high pixel density is implemented in MicroLED display screens, then display resolution is improved, but heat dissipation performance deteriorates

Engineering Contradiction:
Improvedisplay resolutionVSAvoidheat dissipation performance
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The display screen is divided into multiple pixels, each pixel is divided into subpixels (first subpixel and second subpixel), and each subpixel is equipped with independent light scattering structures and metal isolation structures. This segmentation allows heat to be dispersed across multiple small units rather than concentrated in large areas, improving heat dissipation while maintaining high pixel density

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Metal isolation structures are introduced as intermediary elements between adjacent pixels and subpixels. These metal structures serve as heat conduction pathways that transfer heat away from the light-emitting regions, acting as thermal mediators that improve heat dissipation without affecting the optical performance or pixel density

Inventive Principle:
Principle #24Intermediary (Mediator)

2Illumination intensity

If brightness is increased in MicroLED display screens, then display quality is improved, but heat generation increases

Engineering Contradiction:
Improvedisplay brightnessVSAvoidheat generation
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by high-brightness LEDs into beneficial thermal conduction pathways by introducing metal isolation structures. These structures capture the waste heat and channel it away from the light-emitting regions, transforming the harmful thermal energy into a manageable form that can be dissipated without affecting display quality

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

Different regions of the display screen are assigned different functional properties: light scattering structures are placed in light-emitting regions to optimize optical performance, while metal isolation structures are placed in heat-prone regions to optimize thermal management. This local differentiation allows simultaneous optimization of brightness and heat dissipation

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If red light MicroLED material is used, then color display capability is improved, but light emitting efficiency deteriorates

Engineering Contradiction:
Improvecolor display capabilityVSAvoidlight emitting efficiency
Core Design Contradiction:
Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

Light scattering structures are introduced as intermediary optical elements that enhance the light output from red light MicroLEDs. These structures scatter and redirect light that would otherwise be trapped or absorbed, acting as optical mediators that improve the light emitting efficiency of red light subpixels without affecting their color properties

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the optical parameters of the display system by introducing light scattering structures with specific geometric features and material properties. These parameter changes optimize the light extraction efficiency of red light MicroLEDs, compensating for their inherently lower efficiency compared to other colors

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively improves light emitting efficiency, increases display brightness, and provides a good heat dissipation effect, thereby addressing the challenges of high pixel density and heat management in MicroLED display screens.

Implementation Method 1

a light scattering structure, prepared above the first subpixel, and configured to scatter first emitting light generated by the first subpixel

Methodology Applied
Scientific EffectLight scattering: Scattering

Implementation Method 2

a light conversion structure, prepared above the second subpixel, and configured to convert second emitting light generated by the second subpixel

Methodology Applied
Scientific EffectLight conversion: Photoluminescence

Implementation Method 3

a metal isolation structure, prepared between the light scattering structure and the light conversion structure... provides a good heat dissipation effect

Methodology Applied
Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS20250072180A1Micro Light Emitting Diode Display Screen and Preparation Method
Publication Date: 2025.02.27 HUAWEI TECH CO LTD
  • US20250072180A1 patent drawing
  • US20250072180A1 patent drawing
  • US20250072180A1 patent drawing

AI summary

A micro-light emitting diode (MicroLED) display screen includes a MicroLED array substrate, where a plurality of pixels are set in the MicroLED array substrate, and the plurality of pixels include at least a first subpixel and a second subpixel; a light scattering structure, prepared above the first subpixel, and configured to scatter first emitting light generated by the first subpixel; a light conversion structure, prepared above the second subpixel, and configured to convert second emitting light generated by the second subpixel; and a metal isolation structure, prepared between the light scattering structure and the light conversion structure, where the light scattering structure, the light conversion structure, and the metal isolation structure are located at a same layer.