MicroLED Lighting Module Integrated Into Body Panel

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Solution Overview

Problem

Traditional vehicle lighting modules are prone to damage from the injection-molding process and require separate assembly, which leads to moisture leakage due to seal element failures.

Innovation Solution

A microLED lighting module with a micromodule and backplane integrated into a body panel using transparent polymer layers, such as polycarbonate or polymethyl methacrylate, that maintain the module's temperature below 220°C, allowing for integration during injection molding and eliminating the need for additional seals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If lighting modules are produced separately from body panels to avoid heat damage, then lighting module integrity is maintained, but manufacturing complexity and assembly requirements increase

Engineering Contradiction:
Improvelighting module temperatureVSAvoidassembly complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the lighting module and body panel into a single integrated component that can withstand injection-molding temperatures. The lighting module is embedded within the body panel structure, eliminating the need for separate production and assembly processes while protecting the lighting elements from excessive heat through the polymer matrix.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The lighting module is pre-assembled within the body panel housing before the final injection-molding process. This preliminary positioning allows the lighting components to be protected and secured in place before exposure to high temperatures during molding, preventing damage while enabling integration.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If seal elements are used to prevent moisture entry, then moisture protection is improved, but reliability decreases due to seal element failure

Engineering Contradiction:
Improvemoisture protection reliabilityVSAvoidmoisture intrusion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent eliminates seal elements from the design by creating a monolithic integrated structure where the lighting module is embedded directly within the body panel. This removes the interface between separate components where seals would be required, thereby eliminating the failure point associated with seal elements while maintaining moisture protection through the continuous polymer matrix.

Inventive Principle:
Principle #2Taking out (Extraction)

3Temperature

If lighting modules are produced separately to avoid heat damage, then lighting module integrity is maintained, but productivity decreases

Engineering Contradiction:
Improvelighting module temperatureVSAvoidmanufacturing efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent merges the lighting module production with the body panel manufacturing process through integrated injection molding. This allows both components to be produced in a single operation rather than separately, significantly improving productivity while maintaining lighting module integrity through the protective polymer encapsulation that withstands molding temperatures.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the microLED lighting module to withstand high temperatures during injection molding, preventing damage and eliminating the need for separate assembly and additional seals, thus enhancing reliability and durability.

Implementation Method 1

a transparent polymer layer...configured to maintain a temperature of the microLED lighting module below approximately 220 degrees Celsius (°C.)

Methodology Applied
Scientific EffectThermal energy absorption: Absorption (EM radiation)

Implementation Method 2

a high thermal conductivity window frame disposed about the micromodule and adjacent to the polymer body panel portion

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12123583B1MicroLED lighting module
Publication Date: 2024.10.22 GM GLOBAL TECHNOLOGY OPERATIONS LLC
  • US12123583B1 patent drawing
  • US12123583B1 patent drawing
  • US12123583B1 patent drawing

AI summary

A microLED lighting module is disclosed. The microLED lighting module includes a micromodule having one or more transparent polymer layers thereon. Additionally, the one or more transparent polymer lavers are configured to maintain a temperature of the microLED lighting module below approximately 220° C.