MicroLED Self-Assembly Magnet Rows for Uniform Large-Area Transfer

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Solution Overview

Problem

Current methods for manufacturing large-area microLED displays face challenges such as slow assembly times and low production efficiency due to the difficulty in uniformly transferring and positioning millions of semiconductor light-emitting diodes, particularly with self-assembly technologies.

Innovation Solution

A self-assembly device utilizing an electric field and magnetic field to guide semiconductor light-emitting diodes onto a substrate, featuring a chip supply part with a controller that moves in predetermined paths to ensure uniform distribution and positioning, thereby shortening assembly time and improving production efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If self-assembly method is used to transfer microLEDs, then large-area display manufacturing becomes feasible, but assembly time becomes excessively long

Engineering Contradiction:

Improvedisplay areaVSAvoidassembly time

Core Design Contradiction:

Area of stationary objectVSLoss of time

Solution Approach 1:

The patent divides the assembly process into multiple parallel workstations (first workstation for supply, second workstation for assembly, third workstation for inspection). This segmentation allows simultaneous execution of different assembly stages, reducing total assembly time while maintaining large-area manufacturing capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The chip supply part pre-positions and supplies microLEDs to designated locations before the actual assembly process. This preliminary action ensures that microLEDs are already in correct positions when the substrate arrives, eliminating positioning time during assembly and reducing overall assembly time.

Inventive Principle:

Principle #10Preliminary action

2Speed

If conventional transfer methods are used, then assembly speed is maintained, but uniform distribution and positioning of microLEDs cannot be achieved

Engineering Contradiction:

Improveassembly speedVSAvoidpositioning uniformity

Core Design Contradiction:

SpeedVSManufacturing precision

Solution Approach 1:

The patent replaces conventional mechanical transfer methods with a magnetic field-based self-assembly system. Magnets embedded in the substrate attract and position microLEDs with magnetic materials, achieving precise uniform positioning while maintaining high assembly speed through parallel processing at multiple workstations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The microLEDs with magnetic materials self-position on the substrate through magnetic attraction forces. This self-service mechanism eliminates the need for complex mechanical positioning systems, achieving both high speed and high precision uniform distribution simultaneously.

Inventive Principle:

Principle #25Self-service

3Productivity

If more magnets are used to speed up assembly, then assembly time decreases, but device complexity increases

Engineering Contradiction:

Improveassembly throughputVSAvoidmagnet array complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent uses magnets with different magnetic strengths at different locations on the substrate. Areas requiring faster assembly or higher precision have stronger magnets, while other areas use weaker magnets. This local differentiation optimizes assembly throughput without uniformly increasing device complexity across the entire substrate.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device enables efficient and uniform self-assembly of semiconductor light-emitting diodes on a large-area substrate, enhancing production efficiency by minimizing assembly time and addressing the challenges of warpage and non-uniform distribution.

Implementation Method 1

a self-assembly device utilizing an electric field and magnetic field to guide semiconductor light-emitting diodes onto a substrate

Methodology Applied

Scientific EffectMagnetic field: Magnetic Field

Implementation Method 2

a self-assembly device utilizing an electric field and magnetic field to guide semiconductor light-emitting diodes onto a substrate

Methodology Applied

Scientific EffectElectric field: Electric Field

Data Source

PatentUS11804384B2Device for self-assembling semiconductor light-emitting diodes magnets in a plurality of rows

Publication Date: 2023.10.31 LG ELECTRONICS INC

AI summary

Discussed is a device for self-assembling semiconductor light-emitting including: a chip supply part to supply the semiconductor light-emitting diodes to the substrate in cooperation with magnets disposed in a plurality of rows to form the magnetic field, wherein the chip supply part includes: a chip accommodating part to accommodate the semiconductor light-emitting diodes; a vertical moving part to adjust a distance between the chip supply part and the magnets; a horizontal moving part to move the chip supply part such that the chip accommodating part is alternately overlapped with a part of the magnets; and a controller to drive the vertical and horizontal moving parts to control a position of the chip supply part, and the controller moves the chip supply part in at least one of a horizontal direction and a vertical direction at a predetermined path and a plurality of points existing on the predetermined path.