Micro-LED Self-Assembly Using Magnetic and Electric Field Positioning

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Solution Overview

Problem

Current methods for manufacturing large-area displays using micro-LEDs face challenges such as low transfer precision, high defect rates, and high costs due to the difficulty in self-assembling millions of semiconductor light-emitting devices efficiently.

Innovation Solution

A self-assembly method and apparatus utilizing a fluid chamber, magnetic forces, electric fields, and a fluid injector to precisely position and separate semiconductor light-emitting devices on a substrate, allowing for high-yield, low-cost, and high-speed transfer of micro-LEDs onto a large-area substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pick & place method is used for transferring micro-LEDs, then transfer precision can be improved, but productivity decreases due to slow transfer speed

Engineering Contradiction:
Improvetransfer precisionVSAvoidtransfer speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the mechanical pick & place system with a self-assembly system using magnetic fields and fluid dynamics. Micro-LEDs are moved through fluid flow and positioned using magnetic forces, eliminating the need for mechanical grippers and positioning mechanisms, thereby achieving both high precision and high speed simultaneously

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The micro-LEDs self-assemble on the substrate through magnetic attraction and fluid flow guidance rather than being mechanically placed. The system uses the inherent properties of the micro-LEDs (magnetic response, buoyancy) to achieve self-positioning, dramatically increasing transfer speed while maintaining precision through controlled magnetic fields

Inventive Principle:
Principle #25Self-service

2Productivity

If conventional self-assembly method is used, then productivity is improved, but manufacturing precision deteriorates due to assembly defects

Engineering Contradiction:
Improvetransfer speedVSAvoidassembly precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces random Brownian motion-based self-assembly with a controlled system using magnetic fields and fluid flow. The magnetic field provides directional guidance and precise positioning, while fluid flow ensures uniform distribution and prevents aggregation, achieving both high speed and high precision

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces magnetic fields and fluid flow as intermediary mechanisms to guide the self-assembly process. The magnetic field acts as a mediator to position micro-LEDs accurately, while the fluid serves as a mediator to transport and distribute them uniformly, preventing assembly defects

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If large number of micro-LEDs are assembled simultaneously, then productivity is improved, but reliability decreases due to high defect rates

Engineering Contradiction:
Improveassembly throughputVSAvoiddefect rate
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent replaces mechanical handling with magnetic and fluid-based manipulation, eliminating contact-induced damage and contamination. This enables simultaneous assembly of large numbers of micro-LEDs without increasing defect rates, as each device is positioned through field interactions rather than physical contact

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system enables parallel self-assembly of multiple micro-LEDs through controlled magnetic fields and fluid flow patterns. Each micro-LED independently responds to the magnetic field and fluid dynamics, allowing simultaneous positioning without interference, thereby maintaining low defect rates even at high throughput

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the efficient assembly of a large number of semiconductor light-emitting devices at once, reducing defect rates and enabling the recycling of incorrectly assembled devices without damaging the substrate, thus facilitating the production of large-area displays at a lower cost with improved precision.

Implementation Method 1

a magnet that applies a magnetic force to the semiconductor light-emitting devices

Methodology Applied
Scientific EffectMagnetic force: Magnetism

Implementation Method 2

a power supply unit that induces the formation of an electric field on the substrate to allow the semiconductor light-emitting devices to be seated at a preset positions

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 3

a fluid injector that injects fluid to some of the semiconductor light-emitting devices to allow the some semiconductor light-emitting devices seated on the substrate to be separated from the substrate

Methodology Applied
Scientific EffectFluid injection: Fluid Spray

Data Source

PatentUS11869871B2Apparatus and method for self-assembling semiconductor light-emitting device
Publication Date: 2024.01.09 LG ELECTRONICS INC
  • US11869871B2 patent drawing
  • US11869871B2 patent drawing
  • US11869871B2 patent drawing

AI summary

Discussed is an apparatus for self-assembling semiconductor light-emitting devices, the apparatus including a fluid chamber to accommodate the semiconductor light-emitting devices, each semiconductor light-emitting device having a magnetic body; a magnet to apply a magnetic force to the semiconductor light-emitting devices while an assembly substrate is disposed at an assembly position of the self-assembly apparatus; a power supply to induce formation of an electric field on the assembly substrate to allow the semiconductor light-emitting devices to be seated at a preset positions on the assembly substrate in a process of moving the semiconductor light-emitting devices due to a change in a position of the magnet; and a fluid injector to shoot a fluid to some of the semiconductor light-emitting devices to allow the some of the semiconductor light-emitting devices seated on the assembly substrate to be separated from the assembly substrate.