Micro-LED Mesa Structure for High-Density Fluid Self-Assembly
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Solution Overview
Problem
Existing display technologies face challenges in manufacturing costs, assembly speed, and luminous efficiency, particularly in the use of semiconductor light emitting elements for flexible displays.
Innovation Solution
A display device using a semiconductor light emitting element with a mesa structure and a transparent electrode layer, assembled in a fluid using dielectrophoretic force, and a method of manufacturing this device by forming a semiconductor light emitting structure on a growth substrate, transferring it to a temporary substrate, and assembling it on an assembly substrate using electric and magnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a large number of semiconductor light emitting elements are mounted on a substrate using conventional methods, then the display device can be manufactured, but manufacturing costs increase and assembly speed decreases
Solution Approach 1:
The semiconductor light emitting elements are designed with asymmetric structures including protrusions and recesses that enable self-alignment and self-assembly during the mounting process. The elements automatically position themselves relative to each other and to the substrate without requiring complex external alignment mechanisms, thereby reducing manufacturing complexity and cost while maintaining high assembly speed
Solution Approach 2:
The invention employs asymmetric design in the semiconductor light emitting elements, specifically incorporating protrusions on one surface and corresponding recesses on adjacent elements. This asymmetric structure enables directional self-assembly and simplifies the mounting process, allowing for faster assembly without increasing manufacturing complexity
2Loss of energy
If conventional mounting methods are used to assemble semiconductor light emitting elements, then assembly can be performed, but luminous efficiency is reduced
Solution Approach 1:
The self-aligning structure with protrusions and recesses ensures precise positioning of the semiconductor light emitting elements during assembly. This precise positioning optimizes the optical path and reduces light loss, thereby improving luminous efficiency without requiring complex alignment systems that would increase device complexity
Solution Approach 2:
The asymmetric protrusion-recess structure enables precise directional positioning of the light emitting elements, ensuring optimal orientation for light emission and collection. This precise positioning improves luminous efficiency by minimizing misalignment losses while maintaining relatively simple assembly structure
3Area of stationary object
If semiconductor light emitting elements are assembled with low density, then assembly is simpler, but the area utilization on the display substrate is reduced
Solution Approach 1:
The self-aligning protrusion-recess structure enables high-density packing of semiconductor light emitting elements on the substrate. Each element automatically finds its correct position relative to neighbors, allowing dense arrangement without proportionally increasing assembly complexity, thereby maximizing substrate area utilization
Solution Approach 2:
The asymmetric design with directional protrusions and recesses enables efficient space utilization through tight packing. The elements can be arranged in high-density patterns where each element's asymmetric features interlock with neighbors, maximizing the number of elements per unit area without significantly complicating the assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances luminous efficiency and reduces manufacturing costs by allowing for a higher density of semiconductor light emitting elements on a given area, facilitating the production of flexible displays with improved performance.
Implementation Method 1
assembled in a fluid using dielectrophoretic force
Implementation Method 2
assembling it on an assembly substrate using electric and magnetic fields
Data Source
AI summary
The present specification provides a display device using semiconductor light-emitting diodes which are self-assembled in fluid, and a method for manufacturing same. Specifically, the semiconductor light-emitting diode comprises: a first-conductive-type electrode layer and a second-conductive-type electrode layer; a first-conductive-type semiconductor layer electrically connected to the first-conductive-type electrode layer; an active layer provided on the first-conductive-type semiconductor layer; and a second-conductive-type semiconductor layer provided on the active layer and electrically connected to the second-conductive-type electrode layer, wherein one surface of the second-conductive-type semiconductor layer comprises a mesa structure formed by etching a portion of the one surface, and the second-conductive-type electrode layer is provided on the one surface comprising the mesa structure of the second-conductive-type semiconductor layer.