MicroLED Optical Interconnects for Low-Power Chip-to-Chip Data Transfer
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Solution Overview
Problem
High-speed electrical data transfer between chips requires significant power, while laser communication increases complexity and cost.
Innovation Solution
Utilizing microLEDs and microphotodiodes for chip-to-chip communication, where light is transmitted through optical bridges, prisms, or channels, enabling high-speed, low-power data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical data transfer is used for chip-to-chip communication, then high-speed data transfer is achieved, but power consumption increases significantly
Solution Approach 1:
The patent replaces electrical signal transmission through conductive interconnects with optical signal transmission through light. MicroLEDs convert electrical signals to optical signals, which then travel through optical waveguides or free space to microphotodiodes on receiving chips, converting back to electrical signals. This substitution of electrical fields with optical fields fundamentally changes the transmission mechanism, enabling high-speed data transfer with significantly reduced power consumption, especially over distances greater than 5 millimeters where electrical resistance and signal integrity issues become problematic.
Solution Approach 2:
The patent changes the fundamental parameter of signal transmission from electrical to optical domain. By using light instead of electrical currents for data transmission, the system achieves different performance characteristics: optical signals experience no resistance, can travel longer distances without degradation, and consume less power. The microLEDs are specifically designed to modulate light at high speeds, and microphotodiodes are optimized for rapid detection, maintaining high-speed communication capabilities while dramatically reducing power consumption compared to traditional electrical interconnects.
2Use of energy by moving object
If laser communication is used for chip-to-chip data transfer, then power consumption is reduced, but device complexity and cost increase
Solution Approach 1:
The patent employs microLEDs and microphotodiodes with dimensions on the order of micrometers, making them extremely small and potentially manufacturable using standard semiconductor fabrication processes. These micro-scale optoelectronic devices can be integrated directly onto chip surfaces alongside standard CMOS circuitry. The use of conventional fabrication techniques for creating the microLEDs and microphotodiodes, combined with standard optical materials for waveguides and lenses, reduces overall system cost and complexity compared to traditional laser communication systems that require larger, more specialized components.
Solution Approach 2:
The patent integrates multiple functions into unified structures: microLEDs serve as both light sources and potential waveguide inputs, microphotodiodes function as both detectors and waveguide outputs, and optical waveguides can serve multiple routing purposes. The optical interconnect system can be co-integrated with electrical interconnects on the same chip package, allowing hybrid architectures where optical links handle high-speed, long-distance communication while electrical links manage local, low-speed connections. This multi-functionality reduces the need for separate dedicated optical communication modules, thereby reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves high-speed data transfer with reduced power consumption, outperforming electrical connections over distances greater than 5 millimeters.
Implementation Method 1
one or more microLEDs mounted on the first integrated circuit chip... individual microLEDs of the one or more microLEDs create a beam of light
Implementation Method 2
one or more microphotodiodes mounted on the second integrated circuit chip... beam of light to be received by a corresponding microphotodiode
Data Source
AI summary
Technologies for chip-to-chip optical data transfer are disclosed. In the illustrative embodiment, microLEDs on a first chip are used to send data to microphotodiodes on a second chip. The beams from the microLEDs may be sent to the microphotodiodes using an optical bridge, microprisms, a channel through a substrate, a channel defined in a substrate, etc. The microLEDs may be used for high-speed data transfer with low power usage. A chip may include a relatively large number of microLEDs and/or microphotodiodes, allowing for a large bandwidth connection. MicroLEDs and microphotodiodes may be used to connect different parts of the same chip, different chips on the same package, different packages on the same device, or different chips on different devices.