MicroLED Optical Interconnects for High-Density Chiplet Links

Solution Overview

Problem

The increasing demand for high computing and networking performance in applications such as data centers, high-performance computing clusters, and artificial neural networks is hindered by the limitations of traditional integrated circuits (ICs), including decreased marginal performance benefits, increased costs, and the inability to optimize IC processes for different functionalities simultaneously.

Innovation Solution

The use of optical chip-to-chip interconnects with microLEDs as light sources, which provide high connection densities exceeding 10 Tbps/mm and 1 Pbps/cm², low power consumption, and latency approaching the speed of light, enabling efficient communication between chiplets optimized for specific functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If chip-to-chip connections are used to connect chiplets, then functionality can be optimized for different purposes, but connection density decreases and power consumption increases

Engineering Contradiction:

Improvefunctionality optimizationVSAvoidconnection density

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources. This substitution enables chip-to-chip connections to achieve higher connection densities (exceeding 10 Tbps/mm) while reducing power consumption, directly resolving the contradiction between functionality optimization and connection density.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameter of signal transmission from electrical to optical domain. By using microLEDs modulated at rates greater than 1 Gbps to generate optical signals, the system achieves both high connection density and low power consumption while maintaining the ability to optimize different chiplet functionalities.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If chip-to-chip connections are used to connect chiplets, then functionality can be optimized for different purposes, but power consumption increases

Engineering Contradiction:

Improvefunctionality optimizationVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources. This substitution enables chip-to-chip connections to achieve higher connection densities (exceeding 10 Tbps/mm) while reducing power consumption, directly resolving the contradiction between functionality optimization and connection density.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If transistor dimensions are shrunk to increase computing performance, then more functionality can be integrated, but marginal performance benefits decrease and costs increase

Engineering Contradiction:

Improvecomputing performanceVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent divides the computing system into separate chiplets that can be independently manufactured and optimized. Each chiplet can be produced using standard semiconductor fabrication processes, avoiding the need for continuous transistor shrinking. The chiplets are then interconnected using optical links, achieving high performance at lower manufacturing costs.

Inventive Principle:

Principle #1Segmentation

4Device complexity

If a single SoC is used to consolidate functionality, then integration benefits are achieved, but the IC process cannot be optimized for different functionalities simultaneously

Engineering Contradiction:

ImproveintegrationVSAvoidprocess optimization

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent divides the computing system into separate chiplets that can be independently manufactured and optimized. Each chiplet can be produced using standard semiconductor fabrication processes, avoiding the need for continuous transistor shrinking. The chiplets are then interconnected using optical links, achieving high performance at lower manufacturing costs.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution significantly enhances interconnect performance, allowing for higher data transfer rates, reduced power consumption, and improved scalability, thereby addressing the limitations of traditional ICs and enabling more efficient and high-performance processing and networking applications.

Implementation Method 1

optical chip-to-chip interconnects with microLEDs as light sources

Methodology Applied

Scientific EffectLight Emitting Diode: Light Emitting Diode

Implementation Method 2

microLEDs as light sources

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 3

latency approaching the speed of light

Methodology Applied

Scientific EffectLight: Light

Data Source

PatentUS12244355B2Interconnect networks using microLED-based optical links

Publication Date: 2025.03.04 AVICENATECH CORP

AI summary

Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.