MicroLED Optical Couplers for High-Density Interconnects
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Solution Overview
Problem
The limitations of further transistor shrinkage in integrated circuits (ICs) lead to decreasing marginal performance benefits, increased costs, and the inability to simultaneously optimize IC processes for different functionalities, such as logic and memory, which necessitates the development of alternative high-density interconnect solutions.
Innovation Solution
A microLED-based optical interconnect system is proposed, which includes an optical coupling assembly comprising a first array of optoelectronic devices on an IC, a fiber optic bundle, and optical coupling subassemblies with optical elements like lenses and mirrors to efficiently couple light between the microLED arrays and the fiber optic bundle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If transistor dimensions are shrunk to increase transistor counts, then functionality consolidation on a single IC is improved, but performance benefits decrease and costs increase
Solution Approach 1:
The patent divides the system into multiple separate ICs (first IC with optoelectronic devices, second IC with photodetectors) connected via optical interconnects, replacing the approach of consolidating all functionality on a single IC. This segmentation allows each IC to be optimized for its specific function while maintaining high transistor counts without the diminishing returns of further shrinkage on a single chip.
2Reliability
If IC process is optimized for one functionality, then performance for that function is improved, but the ability to simultaneously optimize for different functionalities (logic, memory, high speed I/O) deteriorates
Solution Approach 1:
The patent separates different functional requirements into different ICs - the first IC is optimized for optoelectronic device performance while the second IC is optimized for photodetector performance. Each IC process can be independently optimized for its specific function without compromise, as the functions are distributed across multiple chips rather than forced into a single multi-functional IC.
3Loss of energy
If optical coupling assembly is designed with multiple subassemblies and optical elements, then coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The optical coupling assembly is divided into multiple separate subassemblies - a first optical coupling subassembly on the first IC and a second optical coupling subassembly on the second IC. Each subassembly contains its own optical elements (lenses, mirrors) optimized for its specific coupling function. This segmentation allows for optimized light coupling at each interface while distributing the complexity across modular units rather than requiring a single complex assembly.
Solution Approach 2:
The patent introduces optical coupling subassemblies with optical elements (lenses, mirrors) as intermediary components between the optoelectronic devices and the optical waveguides. These intermediaries enable efficient light coupling by managing the optical paths, focusing light, and correcting alignment tolerances, thereby improving coupling efficiency without requiring direct contact between devices and waveguides.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution offers high-density, low-power chip-to-chip connections, overcoming the limitations of traditional IC interconnects by enabling flexible optimization of each chiplet's process and reducing the need for dense on-chip connections.
Implementation Method 1
optical coupling assembly including at least one first optical element positioned in an optical path of light between the first array of optoelectronic devices and the first face of the first fiber optic bundle
Implementation Method 2
a first fiber optic bundle comprised of multiple fiber elements, with a first face for coupling light into or out of the fiber elements
Data Source
AI summary
A microLED-based optical interconnect may include an optical coupling assembly having a first optical coupling subassembly and a second optical coupling subassembly, which may be coupled together. The first optical coupling subassembly may interface to an IC having an array of optoelectronics devices on its surface. The second optical coupling assembly may receive an end of a fiber optic bundle. Both the first optical coupling subassembly and the second optical coupling subassembly may include optical elements in an optical path between the array of optoelectronic devices and the end of the fiber optic bundle. The optoelectronic devices may be microLEDs or photodetectors.