MicroLED Optical Interconnects for High-Density IC Coupling

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Solution Overview

Problem

Current IC interconnect technologies, such as printed circuit boards and silicon/organic interposers, face limitations in IC and interconnect density, power dissipation, and connection lengths due to ohmic losses and energy constraints, which restrict communication between ICs to nearest neighbors.

Innovation Solution

The implementation of optical interconnects using microLED sources with efficient light coupling systems, including lenses and mirrors, to create high-density optical communication channels that can transmit data over longer distances with low power consumption, utilizing waveguides or free-space optics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional electrical interconnects (PCB traces, interposers) are used to connect ICs, then IC and interconnect density can be increased, but power dissipation increases significantly and connection length is limited

Engineering Contradiction:
ImproveIC and interconnect densityVSAvoidpower dissipation
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources and photodetectors as receivers. This substitution eliminates resistive heating in long interconnect paths, dramatically reducing power dissipation while maintaining high density. The optical channels (waveguides or free-space paths) carry data as light signals between ICs without the energy losses inherent in electrical traces.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental transmission medium from electrical signals to optical signals. By using light instead of electricity for data transmission, the system achieves lower power consumption and reduced heat generation, particularly for longer interconnect distances where electrical resistance would be prohibitive.

Inventive Principle:
Principle #35Parameter changes

2Length of stationary object

If traditional electrical interconnects are used, then connections can be made between ICs, but connection length is severely limited due to ohmic losses

Engineering Contradiction:
Improveinterconnect lengthVSAvoidohmic losses
Core Design Contradiction:
Length of stationary objectVSLoss of energy

Solution Approach 1:

The patent substitutes optical transmission for electrical transmission to overcome ohmic losses. Light signals propagating through optical channels experience minimal attenuation compared to electrical signals in traces, enabling much longer connection lengths without significant energy loss. This allows ICs to be connected over distances impractical for traditional electrical interconnects.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Loss of energy

If microLEDs are used for optical interconnects, then power consumption is reduced and density is increased, but efficient light coupling to small angular acceptance channels is challenging

Engineering Contradiction:
Improvepower consumptionVSAvoidlight coupling efficiency
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent introduces optical elements (lenses, mirrors, or optical systems) as intermediaries between the microLED light sources and the photodetector channels. These optical elements collect and redirect the divergent light from microLEDs, which have large emission angles, into the small angular acceptance cones of the optical channels, achieving efficient coupling without sacrificing the power consumption benefits of microLEDs.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables high-density, low-power optical communication between ICs, overcoming the limitations of traditional interconnects by efficiently coupling light from microLEDs to smaller angular acceptance channels, allowing for more extensive and powerful chip-to-chip connections while reducing power dissipation.

Implementation Method 1

A microLED may be generally defined as a LED with a diameter of 1 m at >1 Gbps with low power consumption and very high density

Methodology Applied
Scientific EffectLight Emitting Diode: Light Emitting Diode

Implementation Method 2

optical elements, including at least one lens, between the array of microLEDs and the optical transmission channel inputs to magnify and focus light from the array of microLEDs onto the optical transmission channel inputs

Methodology Applied
Scientific EffectLens focusing: Lens

Data Source

PatentUS11916598B2Parallel optical communication channels using microLEDs
Publication Date: 2024.02.27 AVICENATECH CORP
  • US11916598B2 patent drawing
  • US11916598B2 patent drawing
  • US11916598B2 patent drawing

AI summary

Coupling of light from large angular distribution microLEDs into smaller angular acceptance distribution of transmission channels is performed using optical elements.