MicroLED Optical Interconnects for Low-Power In-Package Data Transfer
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Solution Overview
Problem
Current electrical interconnects at short distances within integrated circuits face limitations due to high power consumption, signal distortion, capacitance, and 2D confinement, which hinder high-speed computation and data transfer, particularly in AI and GPU applications.
Innovation Solution
The use of microLEDs and 3D waveguides for optical communication between semiconductor chips, enabling fast, low-power, and cost-effective data connections within a common package or substrate, breaking the 2D confinement and improving clock synchronization and data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If electrical interconnects are used for short-distance connections within integrated circuits, then data transfer can be achieved, but power consumption increases and signal distortion occurs
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources and photodetectors as receivers. This substitution eliminates the RC time constant limitations and signal distortion inherent in electrical wiring, while dramatically reducing power consumption for data transfer. The optical system uses light propagation through waveguides or free space to transmit data between chips without the parasitic effects of electrical conductors.
Solution Approach 2:
The patent introduces optical components (microLEDs, photodetectors, waveguides) as intermediary elements between integrated circuits. These intermediaries convert electrical signals to optical signals for transmission, then back to electrical signals for processing, thereby isolating the computing circuits from the lossy electrical interconnect infrastructure while enabling high-speed data transfer.
2Adaptability or versatility
If electrical interconnects are used to connect chips, then data transfer is possible, but the interconnects are confined to a 2D plane limiting connectivity
Solution Approach 1:
The patent transitions from 2D planar interconnects to 3D optical connectivity. Optical signals can propagate through volume using waveguides or free space, enabling vertical and diagonal connections between chips stacked or positioned in three-dimensional space. This dimensional expansion allows for more flexible chip packaging arrangements and higher density interconnections that are not constrained by planar routing limitations.
3Quantity of substance
If more memory is co-packaged with processor using advanced packaging techniques, then memory capacity increases, but complexity of packaging increases
Solution Approach 1:
The patent replaces complex electrical interconnect structures with simpler optical interconnects using microLEDs and photodetectors. This substitution simplifies the packaging architecture by eliminating the need for intricate electrical routing layers, interposers, and redistribution patterns, while enabling higher memory capacity through more efficient use of the packaging volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates high-speed, low-power, and cost-effective data connections, overcoming the limitations of electrical interconnects by enabling efficient data transfer and clock synchronization across chips, enhancing compute power and memory access.
Implementation Method 1
at least one LED on the IC chip
Implementation Method 2
the substrate having at least one waveguide for optically coupling the at least one LED and the at least one photodetector
Implementation Method 3
the substrate having at least one photodetector optically coupled to the at least one LED
Data Source
AI summary
In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.