MicroLED Optical Interconnect Packaging for Precise Fiber Alignment
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Solution Overview
Problem
Current chip-to-chip connections in computing and networking systems are limited by power, density, latency, and distance, hindering system performance, and there is a need for improved interconnect technologies that can integrate with standard packaging processes.
Innovation Solution
A parallel optical link packaging assembly using microLEDs and photodetectors integrated with through-silicon vias, aligned with optical coupling components via a frame and removable lid, and encased in a molding compound, allowing for efficient optical connections between ICs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If electrical interconnects are used for chip-to-chip connections, then device complexity is reduced and ease of manufacture is improved, but power consumption increases and bandwidth is limited
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using microLEDs as light sources. This substitution fundamentally changes the transmission medium from electrical signals to optical signals, thereby reducing power consumption and increasing bandwidth while maintaining manageable device complexity through integrated packaging
Solution Approach 2:
The patent integrates multiple functions into a single packaging structure: the frame provides mechanical support, the removable lid enables fiber alignment and insertion, through-silicon vias provide electrical connections, and microLEDs provide optical transmission. This multi-functionality reduces the need for separate components, balancing the increased functional complexity with streamlined integration
2Productivity
If optical interconnects are implemented, then bandwidth and power efficiency are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates pre-aligned optical coupling components during the packaging process. The removable lid is designed with pre-positioned alignment features that guide fiber optic cables into precise alignment with microLEDs before final assembly, thereby achieving high bandwidth transmission without requiring extreme manufacturing precision in later stages
Solution Approach 2:
The patent introduces optical coupling components (lenses, mirrors, or mode converters) as intermediaries between the microLEDs and fiber optic cables. These intermediaries facilitate precise optical coupling by compensating for minor misalignments, thereby enabling high bandwidth transmission while relaxing the stringent alignment precision requirements that would otherwise be necessary
3Quantity of substance
If through-silicon vias are used to connect optoelectronic devices, then integration density is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the interconnect function into separate segments: through-silicon vias handle electrical connections between die layers, while microLEDs handle optical transmission. This segmentation allows each component to be optimized and manufactured independently using established processes, thereby achieving high integration density without proportionally increasing overall manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances system performance by providing high bandwidth and low power consumption through precise alignment and integration of optical interconnects, overcoming limitations of traditional electrical interconnects.
Implementation Method 1
the optoelectronic device array having a plurality of microLEDs
Implementation Method 2
the optoelectronic device array having a plurality of microLEDs and a plurality of photodetectors
Data Source
AI summary
A packaging and assembly of a parallel optical link is disclosed. The packaging and assembly may have four major parts: assembly of the optical transceiver die, 2.5D package assembly, package attachment to a system printed circuit board, and optical coupling attachment. A frame and a removable lid may be attached to the optical transceiver die. The lid may protect the optical transceiver array of the optical transceiver die, and the frame may help in aligning optical coupling assembly with the optical transceiver array.