Micro-LED Display Panel Liquid-Metal Cooling Between Substrates
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Solution Overview
Problem
Heat generated during the operation of micro-LED display devices is trapped between substrates, leading to deterioration of the display panel and affecting image quality and lifespan due to the lack of effective heat dissipation mechanisms.
Innovation Solution
Incorporating a heat dissipation sheet with a path pattern that allows liquid metal to flow through, enhancing heat dissipation by controlling the mobility of the liquid metal using a flow voltage based on the position of heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are bonded using a sealant to join edges, then structural integrity is improved, but heat dissipation deteriorates because heat is trapped in the internal space between substrates
Solution Approach 1:
A heat dissipation sheet is introduced as an intermediary component between the first and second substrates. This sheet contains liquid metal that flows through path patterns to actively transport heat away from heat-generating areas, thereby resolving the heat trapping problem while preserving the structural bonding function of the sealant
Solution Approach 2:
The patent utilizes liquid metal flowing through defined path patterns on the heat dissipation sheet to create a hydraulic heat transport system. The liquid metal acts as a mobile heat carrier that continuously circulates to remove trapped heat, transforming the static bonding structure into a dynamic thermal management system
2Reliability
If the gap between substrates is maintained for sealant application, then bonding reliability is improved, but heat dissipation performance deteriorates due to trapped heat in the internal space
Solution Approach 1:
The heat dissipation sheet serves as a mediator that addresses the thermal problem without interfering with the bonding gap requirement. The liquid metal flow paths are designed to operate within the existing gap structure, maintaining bonding reliability while adding active heat dissipation functionality
Solution Approach 2:
The heat dissipation sheet performs multiple functions simultaneously: it maintains the structural gap for sealant bonding, provides a pathway for liquid metal flow, and actively dissipates heat. This multi-functionality resolves the contradiction by making the same structural feature serve both bonding and thermal management purposes
3Adaptability or versatility
If driving circuit area is increased to improve functionality, then device capability is improved, but heat generation increases leading to significant deterioration of the display panel
Solution Approach 1:
The heat dissipation sheet implements local quality by concentrating liquid metal flow paths and higher density path patterns in the specific regions where the driving circuit generates heat. This targeted approach addresses heat generation locally without requiring changes to the overall device capability or circuit design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation performance, reduces power consumption, and achieves greenhouse gas reduction by effectively dissipating heat from high-temperature areas to low-temperature areas.
Implementation Method 1
a heat dissipation sheet disposed between the first substrate and the second substrate, and including a path pattern allowing liquid metal to flow therethrough
Implementation Method 2
the density of the path pattern allowing liquid metal to flow therethrough in areas in which high temperature heat is generated may be increased so as to effectively improve heat dissipation performance
Data Source
AI summary
A display device and a display panel. The display device includes a driving circuit configured to drive the display panel. The display panel includes a plurality of light-emitting elements. The display panel includes a first substrate with the driving circuit being provided on a first surface thereof, a second substrate with the light-emitting elements being disposed on a top portion thereof, and a heat dissipation sheet disposed between the first substrate and the second substrate. The heat dissipation sheet includes a path pattern allowing liquid metal to flow therethrough.