Perpendicular Electrode Micro-LED Display for Accurate Chip Connection
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Solution Overview
Problem
The productivity of display devices using micro-semiconductor chips decreases as chip size reduces and device size increases, due to limitations in transfer technologies and repair processes for micro-sized light-emitting devices in LCD backlights and other display applications.
Innovation Solution
A display device with a perpendicular electrode structure is developed, featuring a display substrate with grooves for micro-semiconductor chips, where the chips include n-type and p-type semiconductor layers, and electrodes connected through via holes, allowing for accurate and efficient electrode connection without bonding processes, and a method for manufacturing this device using wet self-alignment and insulating layers to prevent electrical short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pick-and-place method is used to transfer micro-semiconductor chips, then transfer capability is achieved, but productivity decreases as chip size reduces and device size increases
Solution Approach 1:
The invention divides the transfer process into two stages: first, transferring micro-semiconductor chips to a carrier substrate in bulk; second, transferring the entire carrier substrate to the final display device. This segmentation eliminates the need for individual chip placement, significantly improving productivity while reducing process complexity
Solution Approach 2:
The invention introduces a carrier substrate as an intermediary component to hold multiple micro-semiconductor chips during transfer. This mediator enables bulk transfer operations, resolving the contradiction between maintaining transfer capability and improving productivity
2Manufacturing precision
If via holes are formed through display substrate to connect second electrode to n-type semiconductor layer, then electrical connection accuracy is improved, but risk of electrical short circuit increases
Solution Approach 1:
The invention applies different properties to different regions: the via hole region provides precise electrical connection, while the insulating layer region prevents short circuits. By creating spatially differentiated functional zones, the system achieves both connection accuracy and safety
Solution Approach 2:
An insulating layer is introduced as a mediator between the via hole and surrounding conductive elements. This intermediary material enables precise electrical connection through the via hole while preventing harmful electrical short circuits to adjacent structures
3Power
If micro-semiconductor chips are placed in grooves with perpendicular electrode structure, then light emission efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The invention performs preliminary actions by pre-forming grooves and insulating layers on the carrier substrate before chip placement. This advance preparation simplifies the overall manufacturing process by enabling bulk operations rather than individual chip processing
Solution Approach 2:
The invention transitions from planar electrode structures to three-dimensional perpendicular electrode structures, with via holes extending through the substrate thickness. This dimensional change improves light emission efficiency by enabling direct vertical current injection while the pre-formed groove structure manages the manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-resolution display devices with improved productivity by ensuring accurate electrode connections and preventing short circuits, even when micro-semiconductor chips are omitted, allowing for efficient light emission and color conversion.
Implementation Method 1
a color conversion layer provided on the array layer and configured to convert a color of light emitted from the micro-semiconductor chip
Data Source
Figure 1~2A
Figure 2B~2E
Figure 3~4
AI summary
A display device and a method of manufacturing the display device are provided. The display device includes a display substrate including a driving circuit; an array layer provided on the display substrate and including a plurality of grooves; a micro-semiconductor chip provided in a groove of the plurality of grooves, the micro-semiconductor chip including: an n-type semiconductor layer; an active layer provided on the n-type semiconductor layer; a p-type semiconductor layer provided on the active layer; and a first electrode provided on the p-type semiconductor layer; and a second electrode connected to the n-type semiconductor layer from a lower surface of the display substrate; a first wiring connected to the first electrode; and a second wiring connected to the second electrode.